AD8146ACPZ-R2 by Analog Devices, in 24-WFQFN Exposed Pad, CSP package, designed for Differential applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD8147ACPZ-R2 by Analog Devices, in 24-WFQFN Exposed Pad, CSP package, designed for Differential applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD8148ACPZ-R2 by Analog Devices, in 24-WFQFN Exposed Pad, CSP package, designed for Differential applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD8148ACPZ-RL by Analog Devices, in 24-WFQFN Exposed Pad, CSP package, designed for Differential applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD815ARB-24 by Rochester Electronics, in 24-SOIC (0.295", 7.50mm Width), 18 Leads, Fused Leads package, rated for -40°C ~ 85°C. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD815ARB-24-REEL by Rochester Electronics, in 24-SOIC (0.295", 7.50mm Width), 18 Leads, Fused Leads package, rated for -40°C ~ 85°C. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD815ARBZ-24 by Rochester Electronics, in 24-SOIC (0.295", 7.50mm Width), 18 Leads, Fused Leads package, rated for -40°C ~ 85°C. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
AD815ARBZ-24-REEL by Analog Devices, in 24-SOIC (0.295", 7.50mm Width), 18 Leads, Fused Leads package, rated for -40°C ~ 85°C. This part is discontinued. FPGACenter specializes in sourcing obsolete components.