FSA203MTCX by Rochester Electronics, in 20-TSSOP (0.173", 4.40mm Width) package, rated for -40°C ~ 85°C (TA), designed for Audio, USB, Video applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
FSA223L10X by Rochester Electronics, in 10-UFQFN Exposed Pad package, rated for -40°C ~ 85°C (TA), designed for Audio, USB applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
FSA223MUX by Rochester Electronics, in 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) package, rated for -40°C ~ 85°C (TA), designed for Audio, USB applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
FSA223UMX_F106 by Onsemi, in 10-UFQFN package, rated for -40°C ~ 85°C (TA), designed for Audio, USB applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
FSA2268TUMX by Rochester Electronics, in 10-UFQFN package, rated for -40°C ~ 85°C (TA), designed for Audio applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.
FSA2269TSL10X by Rochester Electronics, in 10-UFQFN Exposed Pad package, rated for -40°C ~ 85°C (TA), designed for Audio applications. This part is discontinued. FPGACenter specializes in sourcing obsolete components.