Configuration PROMs for FPGAs
FPGACenter stocks 536 Configuration PROMs for FPGAs part numbers across Atmel, Xilinx, and Altera. Same-day dispatch on in-stock items.
536 products found
| Part Number ↑ | Manufacturer | Description | Stock | Price | Status | |
|---|---|---|---|---|---|---|
| Altera | The EPCS16SI8N is an FPGA manufactured by Altera. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPCS16SI8N is no longer produced by Altera; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $8.59 | OBSOLETE | ||
| Altera | The EPCS1SI8 is an FPGA manufactured by Altera. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPCS1SI8 is no longer produced by Altera; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Altera | The EPCS1SI8N is an FPGA manufactured by Altera. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPCS1SI8N is no longer produced by Altera; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $8.44 | OBSOLETE | ||
| Altera | The EPCS4SI8N is an FPGA manufactured by Altera. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPCS4SI8N is no longer produced by Altera; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $1.91 | OBSOLETE | ||
| Altera | The EPCS4SI8NAA is an FPGA manufactured by Altera. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPCS4SI8NAA is no longer produced by Altera; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Altera | The EPCS64SI16NGA is an FPGA manufactured by Altera. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPCS64SI16NGA is no longer produced by Altera; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Rochester Electronics | The SST27SF010-70-3C-PHE is an FPGA manufactured by Rochester Electronics. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the SST27SF010-70-3C-PHE is currently in active production through Rochester Electronics's standard distribution channels. | 53.746 In Stock | $0.1260 | ACTIVE | ||
| Xilinx | The XC1701LPCG20C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPCG20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $20.70 | OBSOLETE | ||
| Xilinx | The XC1701LPCG20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPCG20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $24.50 | OBSOLETE | ||
| Rochester Electronics | The XC1701LPD8C is an FPGA manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPD8C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $232.42 | OBSOLETE | ||
| Xilinx | The XC1701LPDG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $24.38 | OBSOLETE | ||
| Xilinx | The XC1701LPDG8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPDG8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $28.54 | OBSOLETE | ||
| Rochester Electronics | The XC1701PC20C is an FPGA manufactured by Rochester Electronics. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701PC20C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | $20.93 | OBSOLETE | ||
| Xilinx | The XC1701PC20I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701PC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Xilinx | The XC1701PD8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701PD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Xilinx | The XC1701PD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701PD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Xilinx | The XC1701SO20C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701SO20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Xilinx | The XC1701SO20I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701SO20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | RFQ for sourcing | RFQ | OBSOLETE | ||
| Rochester Electronics | The XC1702LPC44C is an FPGA manufactured by Rochester Electronics. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1702LPC44C is currently in active production through Rochester Electronics's standard distribution channels. | 1.590 In Stock | $19.23 | ACTIVE | ||
| Rochester Electronics | The XC1702LVQ44C is an FPGA manufactured by Rochester Electronics. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1702LVQ44C is currently in active production through Rochester Electronics's standard distribution channels. | 1.533 In Stock | $19.23 | ACTIVE |