Component category
Power Switches & Distribution
Find Power Switches & Distribution from Texas Instruments, ST, and additional brands. 10,863 part numbers available at FPGACenter. No MOQ, fast global shipping.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The BUK219-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK219-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK220-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK220-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $5.04 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK221-50DY,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-7, D²Pak (6 Leads + Tab) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK221-50DY,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-7, D²Pak (6 Leads + Tab) | RFQ for sourcing | $5.40 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK223-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK223-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK224-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK224-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK2914-50SYTS,127 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a TO-220-5 Formed Leads package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK2914-50SYTS,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | $9.19 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BUS1DJC3GWZ-E2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -30°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a UCSP30L1 package and is rated for operation across -30°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUS1DJC3GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | Check | 15.434 In Stock | $0.3564 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1HAL45EFJ-E2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 85°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1HAL45EFJ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 6.735 In Stock | $1.73 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1HD045EFJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 8-HTSOP-J package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1HD045EFJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | Check | 14.184 In Stock | $1.16 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1HJ045EFJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1HJ045EFJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 10.271 In Stock | $0.5634 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1HJC45EFJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 8-HTSOP-J package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1HJC45EFJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | Check | 14.253 In Stock | $1.18 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1HL045EFJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1HL045EFJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 14.670 In Stock | $1.71 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1HLC45EFJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1HLC45EFJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 14.952 In Stock | $0.9720 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LB028FPJ-CE1 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-252-3, DPak (2 Leads + Tab), SC-63 package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LB028FPJ-CE1 is currently in active production through ROHM Semiconductor's standard distribution channels. | TO-252-3, DPak (2 Leads + Tab), SC-63 | 13.837 In Stock | $2.00 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LB085FJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LB085FJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 7.380 In Stock | $0.9889 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LB150FJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LB150FJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 7.500 In Stock | $1.23 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LB300FJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LB300FJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 7.440 In Stock | $0.7803 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LC105FJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LC105FJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 5.865 In Stock | $1.38 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LC300FJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LC300FJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 4.920 In Stock | $1.22 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BV1LE040EFJ-CE2 is a power distribution IC manufactured by ROHM Semiconductor, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 8-HTSOP-J package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BV1LE040EFJ-CE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | Check | 1.560 In Stock | $0.8100 | 1 | ACTIVE |