Special Purpose ICs

Find Special Purpose ICs from Intersil, Maxim, and additional brands. 4,707 part numbers available at FPGACenter. Volume pricing, no minimum order.

Part NumberManufacturerDescriptionStockPriceStatus
ROHM SemiconductorThe BD8622EFV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -10°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-VSSOP (0.173, 4.40mm Width) Exposed Pad package and is rated for operation across -10°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD8622EFV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$8.85OBSOLETE
ROHM SemiconductorThe BD8629FS-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -10°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 16-LSOP (0.173, 4.40mm Width) package and is rated for operation across -10°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD8629FS-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$4.93OBSOLETE
ROHM SemiconductorThe BD9355MWV-BZE2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 1.5V ~ 5.5V supply voltage and -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 36-VFQFN Exposed Pad package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9355MWV-BZE2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BD9355MWV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9355MWV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.2.150 In Stock$6.61ACTIVE
ROHM SemiconductorThe BD9400BFP-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 7V ~ 26V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 25-SOP (0.213", 5.40mm Width) + 2 Heat Tabs package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9400BFP-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.2.300 In StockRFQACTIVE
ROHM SemiconductorThe BD9532EKN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor, part of the H³Reg™ series. Technical highlights include -10°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -10°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9532EKN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BD9533EKN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor, part of the H³Reg™ series. Technical highlights include -10°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -10°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9533EKN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$6.21OBSOLETE
ROHM SemiconductorThe BD9535MUV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor, part of the H³® series. Technical highlights include -10°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -10°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9535MUV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$1.56OBSOLETE
ROHM SemiconductorThe BD9639MWV-BZE2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.5V ~ 5.5V supply voltage and -20°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-VFQFN Exposed Pad package and is rated for operation across -20°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9639MWV-BZE2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BD9639MWV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9639MWV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.4.227 In Stock$3.10ACTIVE
ROHM SemiconductorThe BD9739KN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 1.5V ~ 10V supply voltage and -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 64-VFQFN package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9739KN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$17.10OBSOLETE
ROHM SemiconductorThe BD9745EKN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9745EKN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$1.68OBSOLETE
ROHM SemiconductorThe BD9749MWV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9749MWV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BD9866GUL-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 4V ~ 14V supply voltage and -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-UFBGA, CSPBGA package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9866GUL-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.1.600 In Stock$2.83ACTIVE
ROHM SemiconductorThe BH6111FV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -15°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-LSSOP (0.173, 4.40mm Width) package and is rated for operation across -15°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BH6111FV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$5.40OBSOLETE
ROHM SemiconductorThe BP5302A is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5302A is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BP5302XA is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads, Formed Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5302XA is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BP5310A is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5310A is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcing$8.63OBSOLETE
ROHM SemiconductorThe BP5311A is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5311A is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
ROHM SemiconductorThe BP5311XA is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads, Formed Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5311XA is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.RFQ for sourcingRFQOBSOLETE
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