* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.
Technical Specifications
Category
Integrated Circuits (ICs)/Telecom
Product Status
Active
Operating Temperature
-
Mounting Type
-
Package / Case
-
Current - Supply
-
Interface
-
Supplier Device Package
-
Number of Circuits
-
Power ( Watts)
-
Voltage - Supply
-
Function
-
Product Overview
The BCM53443B0KFSBG is a telecom ics in the Telecom & Specialized family manufactured by Broadcom Limited. This component is currently in active production.
Is the BCM53443B0KFSBG in stock and ready to ship?
Yes, FPGACenter currently has 2.060 units of BCM53443B0KFSBG in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What is the pricing for BCM53443B0KFSBG?
Unit pricing for BCM53443B0KFSBG starts at $354.48 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.
The DS3154N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners.
The LMC567CN/NOPB is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 2V ~ 9V supply voltage and -25°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LMC567CN/NOPB is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
The MAX3941ETG+T is a specialized telecom IC manufactured by Maxim Integrated. Technical highlights include -5.5V ~ -4.9V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MAX3941ETG+T is currently in active production through Maxim Integrated's standard distribution channels.
The LE9500DBJC is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500DBJC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.
The CPC7582BB is a specialized telecom IC manufactured by IXYS. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 110°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 110°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the CPC7582BB is no longer produced by IXYS; FPGACenter maintains verified stock sourced through certified supply chain partners.
The PM5326-FGI is a specialized telecom IC manufactured by Microchip. Technical highlights include 1.2V supply voltage and SFI-4 interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 1292-FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the PM5326-FGI is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.