Orange Symbol: Safe for use during the environmental protection period
Product Overview
The FS-3003 is a mcu, mpu & fpga modules in the Embedded Modules family manufactured by Digi International. This part has been marked as obsolete by Digi International; FPGACenter can quote verified sourcing options through qualified specialty channels.
Yes. FPGACenter can quote FS-3003 through qualified specialty sourcing channels. Availability, lead time, provenance, and pricing are verified before an order is confirmed.
The FS-3003 is marked as obsolete. Are the parts genuine?
Absolutely. All FS-3003 units sourced by FPGACenter are 100% original Digi International components. We follow IDEA-STD-1010 inspection standards and provide full traceability documentation. We specialize in obsolete part sourcing and verify availability before confirming supply.
The ESP8266EX is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a QFN-32 package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP8266EX is currently in active production through Espressif's standard distribution channels.
The MCV-6DB is an FPGA manufactured by ARIES Embedded. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MCV-6DB is currently in active production through ARIES Embedded's standard distribution channels.
The MCV-2DB is an FPGA manufactured by ARIES Embedded. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MCV-2DB is currently in active production through ARIES Embedded's standard distribution channels.
The ESP32-WROOM-32E is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a Module package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP32-WROOM-32E is currently in active production through Espressif's standard distribution channels.
The DS5000T-8-12 is an FPGA manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DS5000T-8-12 is currently in active production through Rochester Electronics's standard distribution channels.
The MYC-C3354-4E512D-80-C-GW is an FPGA manufactured by MYIR Tech. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MYC-C3354-4E512D-80-C-GW is currently in active production through MYIR Tech's standard distribution channels.