HX6540-A01TWA
ActiveTechnical Specifications
| Category | Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules |
| Product Status | Active |
| Operating Temperature | - |
| Mounting Type | Surface Mount |
| Package / Case | 38-UFBGA, WLCSP |
| Supplier Device Package | 38-WLCSP (4.7x1.6) |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, Sensor I/F, WDT |
| Number of I/ O | 4 |
| Speed | 400MHz |
| E E P R O M Size | - |
| Core Processor | ARC EM9D |
| R A M Size | 2M x 8 |
| Program Memory Type | ROMless |
| Core Size | - |
| Connectivity | I²C, PDM, SPI, UART/USART |
| Program Memory Size | - |
| Voltage - Supply ( Vcc/ Vdd) | 1.8V |
| Data Converters | - |
| Oscillator Type | Internal |
| E U Ro H S Status | RoHS Compliant |
| R E A C H Status | Vendor is not defined |
| U S E C C N | Provided as per user requirements |
| China Ro H S Status | Green Symbol: Green and environmentally friendly product |
Product Overview
The HX6540-A01TWA is a microcontrollers (mcu) in the Microcontrollers & Processors family manufactured by Himax. This component is currently in active production.
Key specifications include Category: Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules, Product Status: Active, Operating Temperature: -, Mounting Type: Surface Mount, Package / Case: 38-UFBGA, WLCSP.
This device comes in a 38-UFBGA, WLCSP package with surface mount mounting.
FPGACenter currently has 1.901 units of HX6540-A01TWA in stock, available for immediate shipment with no minimum order quantity.
Application Areas
Frequently Asked Questions
Is the HX6540-A01TWA in stock and ready to ship?
Yes, FPGACenter currently has 1.901 units of HX6540-A01TWA in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the HX6540-A01TWA available in?
The HX6540-A01TWA by Himax is available in a 38-UFBGA, WLCSP package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.