PC817C

Active
300.000 In Stock
MOQ: 50
PackageDIP-4
MountThrough-Hole
Lifecycleactive
ManufacturerSharp

Pricing

1+
$0.0500
10+
$0.0460
100+
$0.0410
500+
$0.0360
1000+
$0.0325
5000+
$0.0290

* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.

Technical Specifications

ManufacturerSharp
Package / CaseDIP-4
Mounting TypeThrough-Hole
Ro H S StatusROHS3 Compliant
Moisture Sensitivity Level ( M S L)3 (168 Hours)
Lifecycle StatusActive
Operating Temperature-40°C ~ 85°C (TA)

Product Overview

The PC817C is a electronic component manufactured by Sharp. This component is currently in active production.

Key specifications include Manufacturer: Sharp, Package / Case: DIP-4, Mounting Type: Through-Hole, Ro H S Status: ROHS3 Compliant, Moisture Sensitivity Level ( M S L): 3 (168 Hours).

This device comes in a DIP-4 package with through-hole mounting.

FPGACenter currently has 300.000 units of PC817C in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Industrial AutomationConsumer ElectronicsTelecommunicationsAutomotive ElectronicsIoT & Smart Devices

Frequently Asked Questions

Is the PC817C in stock and ready to ship?

Yes, FPGACenter currently has 300.000 units of PC817C in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the PC817C available in?

The PC817C by Sharp is available in a DIP-4 package with through-hole mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

What is the pricing for PC817C?

Unit pricing for PC817C starts at $0.0500 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.

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