SM671PAC-AFSS
ActiveTechnical Specifications
| Category | Integrated Circuits (ICs)/Memory Integrated Circuit |
| Product Status | Active |
| Operating Temperature | -40°C ~ 105°C |
| Mounting Type | Surface Mount |
| Package / Case | 153-TFBGA |
| Technology | FLASH - NAND (SLC), FLASH - NAND (TLC) |
| Supplier Device Package | 153-BGA (11.5x13) |
| Memory Size | 160Gb (20G x 8) |
| Memory Type | Non-Volatile |
| Voltage - Supply | - |
| Clock Frequency | - |
| Access Time | - |
| Memory Format | Flash |
| Memory Interface | UFS2.1 |
| Write Cycle Time - Word, Page | - |
| E U Ro H S Status | RoHS Compliant |
| R E A C H Status | REACH is not affected |
| U S E C C N | EAR99 |
| China Ro H S Status | Green Symbol: Green and environmentally friendly product |
Product Overview
The SM671PAC-AFSS is a general memory ics in the Other Memory family manufactured by Silicon Motion. This component is currently in active production.
Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Active, Operating Temperature: -40°C ~ 105°C, Mounting Type: Surface Mount, Package / Case: 153-TFBGA.
This device comes in a 153-TFBGA package with surface mount mounting.
FPGACenter currently has 578 units of SM671PAC-AFSS in stock, available for immediate shipment with no minimum order quantity.
Application Areas
Frequently Asked Questions
Is the SM671PAC-AFSS in stock and ready to ship?
Yes, FPGACenter currently has 578 units of SM671PAC-AFSS in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the SM671PAC-AFSS available in?
The SM671PAC-AFSS by Silicon Motion is available in a 153-TFBGA package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.