* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.
Technical Specifications
Category
Integrated Circuits (ICs)/Specialized ICs
Product Status
Active
Mounting Type
Through Hole
Package / Case
149-BFCPGA Exposed Pad
Type
Digital Micromirror Device (DMD)
Supplier Device Package
149-CPGA (22.3x32.2)
Applications
-
E U Ro H S Status
RoHS Compliant
R E A C H Status
REACH is not affected
U S E C C N
EAR99
China Ro H S Status
Green Symbol: Green and environmentally friendly product
Product Overview
The DLP5532AFYSQ1 is a specialized ics in the Telecom & Specialized family manufactured by Texas Instruments. This component is currently in active production.
Key specifications include Category: Integrated Circuits (ICs)/Specialized ICs, Product Status: Active, Mounting Type: Through Hole, Package / Case: 149-BFCPGA Exposed Pad, Type: Digital Micromirror Device (DMD).
This device comes in a 149-BFCPGA Exposed Pad package with through hole mounting.
FPGACenter currently has 1.531 units of DLP5532AFYSQ1 in stock, available for immediate shipment with no minimum order quantity.
Yes, FPGACenter currently has 1.531 units of DLP5532AFYSQ1 in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the DLP5532AFYSQ1 available in?
The DLP5532AFYSQ1 by Texas Instruments is available in a 149-BFCPGA Exposed Pad package with through hole mounting configuration. All parts are original and shipped in manufacturer-standard packaging.
What is the pricing for DLP5532AFYSQ1?
Unit pricing for DLP5532AFYSQ1 starts at $119.17 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.
The PDTC123JU is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the PDTC123JU is currently in active production through Rochester Electronics's standard distribution channels.
The PUMT1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the PUMT1 is currently in active production through Rochester Electronics's standard distribution channels.
The BZV55-C24 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BZV55-C24 is currently in active production through Rochester Electronics's standard distribution channels.
The BAS116H is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BAS116H is currently in active production through Rochester Electronics's standard distribution channels.
The PTVS30VS1UR115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the PTVS30VS1UR115 is currently in active production through Rochester Electronics's standard distribution channels.
The 74LVC1T45GW125 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 74LVC1T45GW125 is currently in active production through Rochester Electronics's standard distribution channels.