W25M02GVZEJG

Obsolete
Winbond Electronics
RFQ for sourcing
Package8-WDFN Exposed Pad
MountSurface Mount
Lifecycleobsolete
ManufacturerWinbond Electronics

Technical Specifications

CategoryIntegrated Circuits (ICs)/Memory Integrated Circuit
Product StatusObsolete
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case8-WDFN Exposed Pad
TechnologyFLASH - NAND (SLC)
Supplier Device Package8-WSON (8x6)
Memory Size2Gb (256M x 8)
Memory TypeNon-Volatile
Voltage - Supply2.7V ~ 3.6V
Clock Frequency104 MHz
Access Time7 ns
Memory FormatFlash
Memory InterfaceSPI - Quad I/O
Write Cycle Time - Word, Page700µs
E U Ro H S StatusROHS3 Compliant
M S L Rating3 (168 Hours,30°C/60%RH)
R E A C H StatusREACH Unaffected
U S E C C NOBSOLETE
China Ro H S StatusOrange Symbol: Safe for use during the environmental protection period

Product Overview

The W25M02GVZEJG is a flash memory in the Non-Volatile Memory family manufactured by Winbond Electronics. This part has been marked as obsolete by Winbond Electronics; FPGACenter can quote verified sourcing options through qualified specialty channels.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Obsolete, Operating Temperature: -40°C ~ 105°C (TA), Mounting Type: Surface Mount, Package / Case: 8-WDFN Exposed Pad.

This device comes in a 8-WDFN Exposed Pad package with surface mount mounting.

Submit an RFQ for W25M02GVZEJG; FPGACenter will verify availability, provenance, lead time, and pricing before confirming supply.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Can FPGACenter source the W25M02GVZEJG?

Yes. FPGACenter can quote W25M02GVZEJG through qualified specialty sourcing channels. Availability, lead time, provenance, and pricing are verified before an order is confirmed.

What package type is the W25M02GVZEJG available in?

The W25M02GVZEJG by Winbond Electronics is available in a 8-WDFN Exposed Pad package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

The W25M02GVZEJG is marked as obsolete. Are the parts genuine?

Absolutely. All W25M02GVZEJG units sourced by FPGACenter are 100% original Winbond Electronics components. We follow IDEA-STD-1010 inspection standards and provide full traceability documentation. We specialize in obsolete part sourcing and verify availability before confirming supply.

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