W25Q128BVESG

Active
1.306 In Stock
Package8-WDFN Exposed Pad
MountSurface Mount
Lifecyclelastbuy
ManufacturerWinbond Electronics

Technical Specifications

CategoryIntegrated Circuits (ICs)/Memory Integrated Circuit
Product StatusLast Time Buy
Operating Temperature-40°C ~ 125°C (TA)
Mounting TypeSurface Mount
Package / Case8-WDFN Exposed Pad
TechnologyFLASH - NOR
Supplier Device Package8-WSON (8x6)
Memory Size128Mb (16M x 8)
Memory TypeNon-Volatile
Voltage - Supply2.7V ~ 3.6V
Clock Frequency104 MHz
Access Time7 ns
Memory FormatFlash
Memory InterfaceSPI - Quad I/O
Write Cycle Time - Word, Page50µs, 3ms
M S L Rating3 (168 Hours,30°C/60%RH)
R E A C H StatusREACH Unaffected
U S E C C NOBSOLETE
E U Ro H S StatusRoHS Compliant
China Ro H S StatusOrange Symbol: Safe for use during the environmental protection period

Product Overview

The W25Q128BVESG is a flash memory in the Non-Volatile Memory family manufactured by Winbond Electronics.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Last Time Buy, Operating Temperature: -40°C ~ 125°C (TA), Mounting Type: Surface Mount, Package / Case: 8-WDFN Exposed Pad.

This device comes in a 8-WDFN Exposed Pad package with surface mount mounting.

FPGACenter currently has 1.306 units of W25Q128BVESG in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Is the W25Q128BVESG in stock and ready to ship?

Yes, FPGACenter currently has 1.306 units of W25Q128BVESG in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the W25Q128BVESG available in?

The W25Q128BVESG by Winbond Electronics is available in a 8-WDFN Exposed Pad package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

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