W25Q16JWSSIQ

Active
Winbond Electronics
6.468 In Stock
Package8-SOIC (0.209", 5.30mm Width)
MountSurface Mount
Lifecycleactive
ManufacturerWinbond Electronics

Pricing

1+
$0.5040
10+
$0.4637
100+
$0.4133
500+
$0.3629
1000+
$0.3276
5000+
$0.2923

* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.

Technical Specifications

CategoryIntegrated Circuits (ICs)/Memory Integrated Circuit
Product StatusActive
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case8-SOIC (0.209", 5.30mm Width)
TechnologyFLASH - NOR
Supplier Device Package8-SOIC
Memory Size16Mb (2M x 8)
Memory TypeNon-Volatile
Voltage - Supply1.65V ~ 1.95V
Clock Frequency133 MHz
Access Time-
Memory FormatFlash
Memory InterfaceSPI - Quad I/O
Write Cycle Time - Word, Page3ms
E U Ro H S StatusRoHS Compliant
R E A C H StatusREACH is not affected
U S E C C NEAR99
China Ro H S StatusGreen Symbol: Green and environmentally friendly product

Product Overview

The W25Q16JWSSIQ is a flash memory in the Non-Volatile Memory family manufactured by Winbond Electronics. This component is currently in active production.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Active, Operating Temperature: -40°C ~ 85°C (TA), Mounting Type: Surface Mount, Package / Case: 8-SOIC (0.209", 5.30mm Width).

This device comes in a 8-SOIC (0.209", 5.30mm Width) package with surface mount mounting.

FPGACenter currently has 6.468 units of W25Q16JWSSIQ in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Is the W25Q16JWSSIQ in stock and ready to ship?

Yes, FPGACenter currently has 6.468 units of W25Q16JWSSIQ in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the W25Q16JWSSIQ available in?

The W25Q16JWSSIQ by Winbond Electronics is available in a 8-SOIC (0.209", 5.30mm Width) package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

What is the pricing for W25Q16JWSSIQ?

Unit pricing for W25Q16JWSSIQ starts at $0.5040 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.

More from Winbond Electronics

View All Winbond Electronics →
W25X10CLSNIG TR
The W25X10CLSNIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 1Mb (128K x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25X10CLSNIG TR is currently in active production through Winbond Electronics's standard distribution channels.
59.999 pcs In Stock$0.2079
W29N01HVSINA
The W29N01HVSINA is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 1Gb (128M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 48-TFSOP (0.724", 18.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W29N01HVSINA is currently in active production through Winbond Electronics's standard distribution channels.
59.612 pcs In Stock$1.36
W25Q16JWZPIQ
The W25Q16JWZPIQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JWZPIQ is currently in active production through Winbond Electronics's standard distribution channels.
57.814 pcs In Stock$0.5130
W25Q128FVFIG
The W25Q128FVFIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
RFQ for sourcing$1.43
W979H2KBVX1E TR
The W979H2KBVX1E TR is a DRAM memory device manufactured by Winbond Electronics. Key technical specifications include 512Mb (16M x 32) memory size, 1.14V ~ 1.3V, 1.7V ~ 1.95V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 134-VFBGA package and is rated for operation across -25°C ~ 85°C (TC). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W979H2KBVX1E TR is currently in active production through Winbond Electronics's standard distribution channels.
55.288 pcs In Stock$1.97
W972GG6JB-3
The W972GG6JB-3 is a DRAM memory device manufactured by Winbond Electronics. Key technical specifications include 2Gb (128M x 16) memory size, 1.7V ~ 1.9V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 84-TFBGA package and is rated for operation across 0°C ~ 85°C (TC). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W972GG6JB-3 is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
RFQ for sourcing$8.31
Get Quote