W25Q32JWUUIMTR

Active
Winbond Electronics
2.132 In Stock
Package8-UFDFN Exposed Pad
MountSurface Mount
Lifecycleactive
ManufacturerWinbond Electronics

Pricing

1+
$2.32
10+
$2.14
100+
$1.90
500+
$1.67
1000+
$1.51
5000+
$1.35

* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.

Technical Specifications

CategoryIntegrated Circuits (ICs)/Memory Integrated Circuit
Product StatusActive
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case8-UFDFN Exposed Pad
TechnologyFLASH - NOR
Supplier Device Package8-USON (4x3)
Memory Size32Mb (4M x 8)
Memory TypeNon-Volatile
Voltage - Supply1.7V ~ 1.95V
Clock Frequency133 MHz
Access Time6 ns
Memory FormatFlash
Memory InterfaceSPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page5ms
E U Ro H S StatusROHS3 Compliant
M S L Rating3 (168 Hours,30°C/60%RH)
R E A C H StatusREACH Unaffected
U S E C C N3A991B1A
H T S U S8542.32.0071
China Ro H S StatusGreen Symbol: Green and environmentally friendly product

Product Overview

The W25Q32JWUUIMTR is a flash memory in the Non-Volatile Memory family manufactured by Winbond Electronics. This component is currently in active production.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Active, Operating Temperature: -40°C ~ 85°C (TA), Mounting Type: Surface Mount, Package / Case: 8-UFDFN Exposed Pad.

This device comes in a 8-UFDFN Exposed Pad package with surface mount mounting.

FPGACenter currently has 2.132 units of W25Q32JWUUIMTR in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Is the W25Q32JWUUIMTR in stock and ready to ship?

Yes, FPGACenter currently has 2.132 units of W25Q32JWUUIMTR in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the W25Q32JWUUIMTR available in?

The W25Q32JWUUIMTR by Winbond Electronics is available in a 8-UFDFN Exposed Pad package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

What is the pricing for W25Q32JWUUIMTR?

Unit pricing for W25Q32JWUUIMTR starts at $2.32 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.

More from Winbond Electronics

View All Winbond Electronics →
W25X10CLSNIG TR
The W25X10CLSNIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 1Mb (128K x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25X10CLSNIG TR is currently in active production through Winbond Electronics's standard distribution channels.
59.999 pcs In Stock$0.2079
W29N01HVSINA
The W29N01HVSINA is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 1Gb (128M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 48-TFSOP (0.724", 18.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W29N01HVSINA is currently in active production through Winbond Electronics's standard distribution channels.
59.612 pcs In Stock$1.36
W25Q16JWZPIQ
The W25Q16JWZPIQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JWZPIQ is currently in active production through Winbond Electronics's standard distribution channels.
57.814 pcs In Stock$0.5130
W25Q128FVFIG
The W25Q128FVFIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
RFQ for sourcing$1.43
W979H2KBVX1E TR
The W979H2KBVX1E TR is a DRAM memory device manufactured by Winbond Electronics. Key technical specifications include 512Mb (16M x 32) memory size, 1.14V ~ 1.3V, 1.7V ~ 1.95V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 134-VFBGA package and is rated for operation across -25°C ~ 85°C (TC). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W979H2KBVX1E TR is currently in active production through Winbond Electronics's standard distribution channels.
55.288 pcs In Stock$1.97
W972GG6JB-3
The W972GG6JB-3 is a DRAM memory device manufactured by Winbond Electronics. Key technical specifications include 2Gb (128M x 16) memory size, 1.7V ~ 1.9V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 84-TFBGA package and is rated for operation across 0°C ~ 85°C (TC). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W972GG6JB-3 is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
RFQ for sourcing$8.31
Get Quote