EZ80F91AZA050SG
ActiveTechnical Specifications
| Category | Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules |
| Product Status | Active |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Supplier Device Package | 144-LQFP (20x20) |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Number of I/ O | 32 |
| Speed | 50MHz |
| E E P R O M Size | - |
| Core Processor | eZ80 |
| R A M Size | 16K x 8 |
| Program Memory Type | Flash |
| Core Size | 8-Bit |
| Connectivity | Ethernet, I²C, IrDA, SPI, UART/USART |
| Program Memory Size | 256KB (256K x 8) |
| Voltage - Supply ( Vcc/ Vdd) | 3V ~ 3.6V |
| Data Converters | - |
| Oscillator Type | Internal |
| E U Ro H S Status | ROHS3 Compliant |
| M S L Rating | 3 (168 Hours,30°C/60%RH) |
| R E A C H Status | REACH Unaffected |
| U S E C C N | EAR99 |
| China Ro H S Status | Green Symbol: Green and environmentally friendly product |
Product Overview
The EZ80F91AZA050SG is a microcontrollers (mcu) in the Microcontrollers & Processors family manufactured by Zilog. This component is currently in active production.
Key specifications include Category: Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules, Product Status: Active, Operating Temperature: 0°C ~ 70°C (TA), Mounting Type: Surface Mount, Package / Case: 144-LQFP.
This device comes in a 144-LQFP package with surface mount mounting.
FPGACenter currently has 2.049 units of EZ80F91AZA050SG in stock, available for immediate shipment with no minimum order quantity.
Application Areas
Frequently Asked Questions
Is the EZ80F91AZA050SG in stock and ready to ship?
Yes, FPGACenter currently has 2.049 units of EZ80F91AZA050SG in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the EZ80F91AZA050SG available in?
The EZ80F91AZA050SG by Zilog is available in a 144-LQFP package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.