Component category
Interface Controllers
FPGACenter stocks 3,537 Interface Controllers part numbers across Microchip, Rochester, and Broadcom. IDEA-1010 inspected, worldwide delivery.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| FTDI, Future Technology Devices International Ltd | The FT4222HQ-C-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V, 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and I²C, SPI interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT4222HQ-C-T is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-VFQFN Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| FTDI, Future Technology Devices International Ltd | The FT4222HQ-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V, 2.5V, 3.3V supply voltage, -40°C ~ 85°C operating temperature, and I²C interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT4222HQ-R is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-VFQFN Exposed Pad | RFQ for sourcing | $5.35 | 1 | OBSOLETE | ||
| FTDI, Future Technology Devices International Ltd | The FT4222HQ-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V, 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and I²C, SPI interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT4222HQ-T is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-VFQFN Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| FTDI, Future Technology Devices International Ltd | The FT4232HAQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.32V supply voltage, -40°C ~ 105°C (TA) operating temperature, and I²C, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT4232HAQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 64-VFQFN Exposed Pad | 2.714 In Stock | $83973.82 | 1 | ACTIVE | ||
| FTDI Chip | The FT4232HL-TRAY is an interface IC manufactured by FTDI Chip, part of the USBmadeEZ-FIFO series. Key technical specifications include 3V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-LQFP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT4232HL-TRAY is currently in active production through FTDI Chip's standard distribution channels. | 64-LQFP | 7.955 In Stock | $5.71 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT4232HPQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.08V ~ 1.32V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, FIFO, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT4232HPQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 68-VFQFN Exposed Pad | 1.525 In Stock | $53147.36 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT4232HPQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.08V ~ 1.32V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, FIFO, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT4232HPQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 68-VFQFN Exposed Pad | 3.120 In Stock | $6.23 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT4232HQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT4232HQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 64-VFQFN Exposed Pad | 26.374 In Stock | $8.48 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT4233HPQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.08V ~ 1.32V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, FIFO, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 76-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT4233HPQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 76-VFQFN Exposed Pad | 2.455 In Stock | $53898.94 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT600Q-B-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.65V ~ 1.95V, 2.3V ~ 2.7V, 3V ~ 3.6V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 56-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT600Q-B-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 56-VFQFN Exposed Pad | 1.276 In Stock | $32.26 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT600Q-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.65V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 56-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT600Q-T is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-VFQFN Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| FTDI, Future Technology Devices International Ltd | The FT601Q-B-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.65V ~ 1.95V, 2.3V ~ 2.7V, 3V ~ 3.6V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 76-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT601Q-B-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 76-VFQFN Exposed Pad | 9.480 In Stock | $7.88 | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT601Q-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.65V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 76-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT601Q-T is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners. | 76-VFQFN Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| FTDI, Future Technology Devices International Ltd | The FT602Q-B-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 0.9V ~ 1.1V, 1.65V ~ 1.95V, 2.3V ~ 2.7V, 3V ~ 3.6V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO, I²C, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 76-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT602Q-B-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels. | 76-VFQFN Exposed Pad | 2.560 In Stock | RFQ | 1 | ACTIVE | ||
| FTDI, Future Technology Devices International Ltd | The FT602Q-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V, 2.5V, 3.3V supply voltage, -40°C ~ 85°C operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 76-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT602Q-T is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners. | 76-VFQFN Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Onsemi | The FUSB251UCX is an interface IC manufactured by Onsemi. Key technical specifications include 2.7V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 15-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB251UCX is currently in active production through Onsemi's standard distribution channels. | 15-UFBGA, WLCSP | 48.000 In Stock | $0.6921 | 1 | ACTIVE | ||
| Rochester Electronics | The FUSB300UCX is an interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB300UCX is currently in active production through Rochester Electronics's standard distribution channels. | Check | 12.716 In Stock | $0.6895 | 1 | ACTIVE | ||
| Rochester Electronics | The FUSB300UCX-FS is an interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB300UCX-FS is currently in active production through Rochester Electronics's standard distribution channels. | Check | 20 In Stock | $0.5490 | 1 | ACTIVE | ||
| Onsemi | The FUSB301ATM1X is an interface IC manufactured by Onsemi. Key technical specifications include 2.8V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 12-XFQFN package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB301ATM1X is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 12-XFQFN | RFQ for sourcing | $0.2700 | 1 | OBSOLETE | ||
| Rochester Electronics | The FUSB301ATMX-SN00362 is an interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB301ATMX-SN00362 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 6.064 In Stock | $0.6421 | 1 | ACTIVE |