Legacy FPGA
Xilinx Spartan-6 FPGA Sourcing
Source Spartan-6 FPGAs for sustaining production, repairs, and redesign bridge buys with stock, date code, and lead-time verification.
XC6SLXXC6SSpartan-6 replacement stock
Before you buy: verify the exact lot.FPGACenter confirms package, speed grade, date code, MOQ, lead time, and acceptable alternates before order commitment.
| Part Number | Manufacturer | Description | Package | Stock | Lead Time | Status | |
|---|---|---|---|---|---|---|---|
| XC6SLX9-2CPG196I | Xilinx | The XC6SLX9-2CPG196I is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 196-TFBGA, CSBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2CPG196I is currently in active production through Xilinx's standard distribution channels. | 196-TFBGA, CSBGA | 15.782 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-2TQG144C | Xilinx | The XC6SLX9-2TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 15.600 In Stock | 3-5 days | ACTIVE | Verify |
| XC6SLX25-3CSG324I | Xilinx | The XC6SLX25-3CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-3CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 14.673 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-2FTG256I | Xilinx | The XC6SLX25-2FTG256I is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-2FTG256I is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 13.500 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-3FTG256I | Xilinx | The XC6SLX9-3FTG256I is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-3FTG256I is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 13.209 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX16-3CSG225C | Xilinx | The XC6SLX16-3CSG225C is an FPGA manufactured by Xilinx. Key technical specifications include 14579 logic elements, 1139 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 225-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX16-3CSG225C is currently in active production through Xilinx's standard distribution channels. | 225-LFBGA, CSPBGA | 12.861 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-3FGG484C | Xilinx | The XC6SLX25-3FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-3FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 12.270 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-2FTG256C | Xilinx | The XC6SLX25-2FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-2FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 12.000 In Stock | 2-4 weeks | ACTIVE | Verify |
| XC6SLX16-2CPG196I | Xilinx | The XC6SLX16-2CPG196I is an FPGA manufactured by Xilinx. Key technical specifications include 14579 logic elements, 1139 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 196-TFBGA, CSBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX16-2CPG196I is currently in active production through Xilinx's standard distribution channels. | 196-TFBGA, CSBGA | 12.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-3TQG144C | Xilinx | The XC6SLX9-3TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-3TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 12.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX45-2CSG484I | Xilinx | The XC6SLX45-2CSG484I is an FPGA manufactured by Xilinx. Key technical specifications include 43661 logic elements, 3411 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-FBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX45-2CSG484I is currently in active production through Xilinx's standard distribution channels. | 484-FBGA, CSPBGA | 11.925 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX4-2TQG144I | Xilinx | The XC6SLX4-2TQG144I is an FPGA manufactured by Xilinx. Key technical specifications include 3840 logic elements, 300 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX4-2TQG144I is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 10.800 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX16-2FTG256C | Xilinx | The XC6SLX16-2FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 14579 logic elements, 1139 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX16-2FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 10.560 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-2CSG225C | Xilinx | The XC6SLX9-2CSG225C is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 225-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2CSG225C is currently in active production through Xilinx's standard distribution channels. | 225-LFBGA, CSPBGA | 10.440 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX45-2FGG484C | Xilinx | The XC6SLX45-2FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 43661 logic elements, 3411 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX45-2FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 10.215 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX45-3CSG324C | Xilinx | The XC6SLX45-3CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 43661 logic elements, 3411 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX45-3CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 9.840 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX75-2CSG484I | Xilinx | The XC6SLX75-2CSG484I is an FPGA manufactured by Xilinx. Key technical specifications include 74637 logic elements, 5831 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-FBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX75-2CSG484I is currently in active production through Xilinx's standard distribution channels. | 484-FBGA, CSPBGA | 9.777 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-2CSG324I | Xilinx | The XC6SLX25-2CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-2CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 9.480 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-2TQG144I | Xilinx | The XC6SLX9-2TQG144I is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2TQG144I is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 9.246 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX45-2CSG324I | Xilinx | The XC6SLX45-2CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 43661 logic elements, 3411 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX45-2CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 9.213 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX75-3FGG484C | Xilinx | The XC6SLX75-3FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 74637 logic elements, 5831 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX75-3FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 9.150 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX45T-3FGG484I | Xilinx | The XC6SLX45T-3FGG484I is an FPGA manufactured by Xilinx. Key technical specifications include 43661 logic elements, 3411 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX45T-3FGG484I is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 9.090 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX100-3FGG484C | Xilinx | The XC6SLX100-3FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 101261 logic elements, 7911 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX100-3FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 8.445 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-2CSG324I | Xilinx | The XC6SLX9-2CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 8.400 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-L1CSG324I | Xilinx | The XC6SLX25-L1CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-L1CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 8.271 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-2FGG484I | Xilinx | The XC6SLX25-2FGG484I is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-2FGG484I is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 7.920 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-2FTG256C | Xilinx | The XC6SLX9-2FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 7.920 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX4-2TQG144C | Xilinx | The XC6SLX4-2TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 3840 logic elements, 300 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX4-2TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 7.866 In Stock | 1-2 weeks | ACTIVE | Verify |
| XC6SLX9-3CSG225C | Xilinx | The XC6SLX9-3CSG225C is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 225-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-3CSG225C is currently in active production through Xilinx's standard distribution channels. | 225-LFBGA, CSPBGA | 7.626 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX16-2CSG324C | Xilinx | The XC6SLX16-2CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 14579 logic elements, 1139 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX16-2CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 7.536 In Stock | 2-3 weeks | ACTIVE | Verify |
| XC6SLX16-2CSG225I | Xilinx | The XC6SLX16-2CSG225I is an FPGA manufactured by Xilinx. Key technical specifications include 14579 logic elements, 1139 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 225-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX16-2CSG225I is currently in active production through Xilinx's standard distribution channels. | 225-LFBGA, CSPBGA | 6.900 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX75T-2CSG484I | Xilinx | The XC6SLX75T-2CSG484I is an FPGA manufactured by Xilinx. Key technical specifications include 74637 logic elements, 5831 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-FBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX75T-2CSG484I is currently in active production through Xilinx's standard distribution channels. | 484-FBGA, CSPBGA | 6.849 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX150-3FGG484C | Xilinx | The XC6SLX150-3FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 147443 logic elements, 11519 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX150-3FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 6.462 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX100-2FGG676I | Xilinx | The XC6SLX100-2FGG676I is an FPGA manufactured by Xilinx. Key technical specifications include 101261 logic elements, 7911 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX100-2FGG676I is currently in active production through Xilinx's standard distribution channels. | 676-BGA | 6.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX25-3CSG324C | Xilinx | The XC6SLX25-3CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 24051 logic elements, 1879 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX25-3CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 6.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX45T-2CSG324I | Xilinx | The XC6SLX45T-2CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 43661 logic elements, 3411 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX45T-2CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 6.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX75-3FGG676I | Xilinx | The XC6SLX75-3FGG676I is an FPGA manufactured by Xilinx. Key technical specifications include 74637 logic elements, 5831 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX75-3FGG676I is currently in active production through Xilinx's standard distribution channels. | 676-BGA | 6.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-2CSG225I | Xilinx | The XC6SLX9-2CSG225I is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 225-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-2CSG225I is currently in active production through Xilinx's standard distribution channels. | 225-LFBGA, CSPBGA | 6.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-3CSG324C | Xilinx | The XC6SLX9-3CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-3CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 6.000 In Stock | RFQ | ACTIVE | Verify |
| XC6SLX9-3TQG144I | Xilinx | The XC6SLX9-3TQG144I is an FPGA manufactured by Xilinx. Key technical specifications include 9152 logic elements, 715 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC6SLX9-3TQG144I is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 6.000 In Stock | RFQ | ACTIVE | Verify |
How to reduce sourcing risk for Spartan-6
Match the full ordering code
Package, speed grade, temperature range, and lead finish can change whether a device is usable in an existing board.
Ask for lot-level evidence
For older FPGA and CPLD parts, request date code, packaging condition, traceability notes, and inspection scope before purchase.
Check approved alternates early
When the exact part is constrained, pre-approved alternates or same-family package equivalents can protect repair and production timelines.