Component category
Interface Controllers
FPGACenter stocks 3,537 Interface Controllers part numbers across Microchip, Rochester, and Broadcom. IDEA-1010 inspected, worldwide delivery.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Flip Electronics | The FUSB3307D6A0BFMX is an interface IC manufactured by Flip Electronics. Key technical specifications include 4.75V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3307D6A0BFMX is currently in active production through Flip Electronics's standard distribution channels. | 14-SOIC (0.154", 3.90mm Width) | 9.402 In Stock | $17.26 | 1 | ACTIVE | ||
| Onsemi | The FUSB3307D6MNWTWG is an interface IC manufactured by Onsemi. Key technical specifications include 4.75V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3307D6MNWTWG is currently in active production through Onsemi's standard distribution channels. | 20-VFQFN Exposed Pad | 7.158 In Stock | $1.31 | 1 | ACTIVE | ||
| Onsemi | The FUSB3307D6VMNWTWG is an interface IC manufactured by Onsemi. Key technical specifications include 4.75V ~ 5.5V supply voltage, -40°C ~ 105°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3307D6VMNWTWG is currently in active production through Onsemi's standard distribution channels. | 20-VFQFN Exposed Pad | 1.501 In Stock | $3.20 | 1 | ACTIVE | ||
| Onsemi | The FUSB3307D90B0AFMNWTWG is an interface IC manufactured by Onsemi. Key technical specifications include 4.75V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3307D90B0AFMNWTWG is currently in active production through Onsemi's standard distribution channels. | 20-VFQFN Exposed Pad | 11.970 In Stock | $2.39 | 1 | ACTIVE | ||
| Onsemi | The FUSB3307P6A0BFMNWTWG is an interface IC manufactured by Onsemi. Key technical specifications include 4.75V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3307P6A0BFMNWTWG is currently in active production through Onsemi's standard distribution channels. | 20-VFQFN Exposed Pad | 11.688 In Stock | $1.34 | 1 | ACTIVE | ||
| Onsemi | The FUSB3317F6AMNWTWG is an interface IC manufactured by Onsemi. Key technical specifications include 4.5V ~ 5.5V, 4.75V ~ 5.5V supply voltage, -40°C ~ 85°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3317F6AMNWTWG is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-VFQFN Exposed Pad | RFQ for sourcing | $1.38 | 1 | OBSOLETE | ||
| Onsemi | The FUSB3317V6AMNWTWG is an interface IC manufactured by Onsemi. Key technical specifications include 4.5V ~ 5.5V, 4.75V ~ 5.5V supply voltage, -40°C ~ 105°C (TA) operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB3317V6AMNWTWG is currently in active production through Onsemi's standard distribution channels. | 20-VFQFN Exposed Pad | 12.000 In Stock | $1.42 | 1 | ACTIVE | ||
| Onsemi | The FUSB380CUCX is an interface IC manufactured by Onsemi. Key technical specifications include 2.4V ~ 5.5V supply voltage, -40°C ~ 85°C operating temperature, and USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 12-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FUSB380CUCX is currently in active production through Onsemi's standard distribution channels. | 12-UFBGA, WLCSP | 13.947 In Stock | $0.4811 | 1 | ACTIVE | ||
| Rochester Electronics | The FXLA102L8X-F106 is an interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the FXLA102L8X-F106 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 32.039 In Stock | $0.6063 | 1 | ACTIVE | ||
| Intel | The FYMD4470CSCB is an interface IC manufactured by Intel. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the FYMD4470CSCB is no longer produced by Intel; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $16.10 | 1 | OBSOLETE | ||
| Intel | The GD82550ELSL4MK is an interface IC manufactured by Intel. Technical highlights include PCI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 196-BGA package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GD82550ELSL4MK is no longer produced by Intel; FPGACenter maintains verified stock sourced through certified supply chain partners. | 196-BGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The GD82550EY is an interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GD82550EY is currently in active production through Rochester Electronics's standard distribution channels. | Check | 17.228 In Stock | $2.90 | 1 | ACTIVE | ||
| Rochester Electronics | The GD82550GY is an interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GD82550GY is currently in active production through Rochester Electronics's standard distribution channels. | Check | 15.598 In Stock | $2.79 | 1 | ACTIVE | ||
| Intel | The GD82550GYSL4Y5 is an interface IC manufactured by Intel. Technical highlights include PCI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 196-BGA package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GD82550GYSL4Y5 is no longer produced by Intel; FPGACenter maintains verified stock sourced through certified supply chain partners. | 196-BGA | RFQ for sourcing | $61.40 | 1 | OBSOLETE | ||
| Greenliant | The GLS55LC200-60-C-TQWE is an interface IC manufactured by Greenliant. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a TQFP-100 package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GLS55LC200-60-C-TQWE is currently in active production through Greenliant's standard distribution channels. | TQFP-100 | 1.065 In Stock | RFQ | 1 | ACTIVE | ||
| Greenliant | The GLS55LD040M-133-I-BZJE is an interface IC manufactured by Greenliant. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GLS55LD040M-133-I-BZJE is currently in active production through Greenliant's standard distribution channels. | Check | 1.217 In Stock | RFQ | 1 | ACTIVE | ||
| Greenliant | The GLS55VD020-60-C-TQWE-T is an interface IC manufactured by Greenliant. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GLS55VD020-60-C-TQWE-T is currently in active production through Greenliant's standard distribution channels. | Check | 1.340 In Stock | $8.51 | 1 | ACTIVE | ||
| Greenliant | The GLS55VD020-60-I-TQWE is an interface IC manufactured by Greenliant. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GLS55VD020-60-I-TQWE is currently in active production through Greenliant's standard distribution channels. | Check | 1.524 In Stock | RFQ | 1 | ACTIVE | ||
| Greenliant | The GLS55VD020-60-I-TQWE-T is an interface IC manufactured by Greenliant. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GLS55VD020-60-I-TQWE-T is currently in active production through Greenliant's standard distribution channels. | Check | 1.920 In Stock | $12.68 | 1 | ACTIVE | ||
| Greenliant | The GLS55VD020-60-I-TQWE-TM024 is an interface IC manufactured by Greenliant. Technical highlights include + 85 C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a TQFP-100 package and is rated for operation across + 85 C. Designed for networking equipment, industrial automation, and telecommunications applications, the GLS55VD020-60-I-TQWE-TM024 is currently in active production through Greenliant's standard distribution channels. | TQFP-100 | 2.445 In Stock | $22.56 | 1 | ACTIVE |