Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Rochester Electronics | The BSP742RI is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RI is currently in active production through Rochester Electronics's standard distribution channels. | Check | 13.800 In Stock | $1.70 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP742RINT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RINT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP742RIXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RIXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 36.000 In Stock | $0.9360 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP742RNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP742RXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 17.439 In Stock | $1.58 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP742TNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742TNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP752RNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752RNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP752RXUMA2 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752RXUMA2 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 30.893 In Stock | $1.11 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP752TNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752TNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP752TXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752TXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 15.943 In Stock | $1.84 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75GQTA is a power distribution IC manufactured by Diodes Incorporated, part of the Automotive, AEC-Q101, INTELLIFET® series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75GQTA is currently in active production through Diodes Incorporated's standard distribution channels. | TO-261-4, TO-261AA | 9.607 In Stock | $0.6506 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75GQTC is a power distribution IC manufactured by Diodes Incorporated, part of the Automotive, AEC-Q101, INTELLIFET® series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in an SOT-223-3 package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75GQTC is currently in active production through Diodes Incorporated's standard distribution channels. | Check | 547 In Stock | $1.86 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75GTA is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75GTA is currently in active production through Diodes Incorporated's standard distribution channels. | TO-261-4, TO-261AA | 13.831 In Stock | $1.49 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP75NHUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NHUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | TO-261-4, TO-261AA | 1.540 In Stock | $0.8277 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP75NNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Diodes Incorporated | The BSP75NQTA is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NQTA is currently in active production through Diodes Incorporated's standard distribution channels. | TO-261-4, TO-261AA | 12.163 In Stock | $0.5063 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75NTA is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NTA is currently in active production through Diodes Incorporated's standard distribution channels. | TO-261-4, TO-261AA | 13.307 In Stock | $0.4488 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP76 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP762TNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP762TNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP762TXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP762TXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 23.994 In Stock | $1.24 | 1 | ACTIVE |