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Component category

SRAM

Find SRAM from Renesas, Rochester, and additional brands. 17,611 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Cypress SemiconductorThe 5962-9232406MYA is an SRAM memory device manufactured by Cypress Semiconductor. Key technical specifications include 64Kb (8K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 28-LCC package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962-9232406MYA is no longer produced by Cypress Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.28-LCCRFQ for sourcing$791.651OBSOLETE
Rochester ElectronicsThe 5962-9459901MYA is an SRAM memory device manufactured by Rochester Electronics. Key technical specifications include 64Kb (8K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 28-LCC package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962-9459901MYA is currently in active production through Rochester Electronics's standard distribution channels.28-LCC24.787 In Stock$89.991ACTIVE
Flip ElectronicsThe 5962-9459903MXA is an SRAM memory device manufactured by Flip Electronics. Key technical specifications include 64Kb (8K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-CDIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962-9459903MXA is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.28-CDIP (0.300", 7.62mm)RFQ for sourcing$2237.501OBSOLETE
Cypress SemiconductorThe 5962F1120101QXA is an SRAM memory device manufactured by Cypress Semiconductor. Key technical specifications include 72Mb (4M x 18) memory size, 1.7V ~ 1.9V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 165-BFCPGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962F1120101QXA is no longer produced by Cypress Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.165-BFCPGARFQ for sourcing$10000.001OBSOLETE
Cypress SemiconductorThe 5962F1120102QXA is an SRAM memory device manufactured by Cypress Semiconductor. Key technical specifications include 72Mb (4M x 18) memory size, 1.7V ~ 1.9V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 165-BFCPGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962F1120102QXA is no longer produced by Cypress Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.165-BFCPGARFQ for sourcing$10000.001OBSOLETE
Cypress SemiconductorThe 5962F1120201QXA is an SRAM memory device manufactured by Cypress Semiconductor. Key technical specifications include 72Mb (2M x 36) memory size, 1.7V ~ 1.9V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 165-BFCPGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962F1120201QXA is no longer produced by Cypress Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.165-BFCPGARFQ for sourcing$89.991OBSOLETE
Cypress SemiconductorThe 5962F1120202QXA is an SRAM memory device manufactured by Cypress Semiconductor. Key technical specifications include 72Mb (2M x 36) memory size, 1.7V ~ 1.9V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 165-BFCPGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962F1120202QXA is no longer produced by Cypress Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.165-BFCPGARFQ for sourcing$10000.001OBSOLETE
Cypress SemiconductorThe 5962F1123501QXA is an SRAM memory device manufactured by Cypress Semiconductor. Key technical specifications include 4Mb (512K x 8) memory size, 3V ~ 3.6V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 36-CFlatPack package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 5962F1123501QXA is no longer produced by Cypress Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.36-CFlatPackRFQ for sourcing$3042.881OBSOLETE
RenesasThe 6116LA120DB is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 24-CDIP (0.600", 15.24mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA120DB is currently in active production through Renesas's standard distribution channels.24-CDIP (0.600", 15.24mm)553 In Stock$43.661ACTIVE
RenesasThe 6116LA120TDB is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 24-CDIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA120TDB is currently in active production through Renesas's standard distribution channels.24-CDIP (0.300", 7.62mm)2.374 In Stock$43.661ACTIVE
RenesasThe 6116LA150DB is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 24-CDIP (0.600", 15.24mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA150DB is currently in active production through Renesas's standard distribution channels.24-CDIP (0.600", 15.24mm)30.537 In Stock$6.481ACTIVE
RenesasThe 6116LA150TDB is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 24-CDIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA150TDB is currently in active production through Renesas's standard distribution channels.24-CDIP (0.300", 7.62mm)47.477 In Stock$8.551ACTIVE
Rochester ElectronicsThe 6116LA15SOG is an SRAM memory device manufactured by Rochester Electronics. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA15SOG is currently in active production through Rochester Electronics's standard distribution channels.24-SOIC (0.295", 7.50mm Width)5.670 In Stock$3.101ACTIVE
RenesasThe 6116LA15SOGI8 is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA15SOGI8 is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners.24-SOIC (0.295", 7.50mm Width)RFQ for sourcing$9.651OBSOLETE
RenesasThe 6116LA15TPGI is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kbit memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 24-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA15TPGI is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners.24-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
RenesasThe 6116LA19TPG is an SRAM memory device manufactured by Renesas. Technical highlights include 16Kbit memory size and Volatile memory type; design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits. This Through Hole component is supplied in a 24-DIP (0.300, 7.62mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA19TPG is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners.24-DIP (0.300, 7.62mm)RFQ for sourcingRFQ1OBSOLETE
RenesasThe 6116LA19TPGI is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kbit memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 24-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA19TPGI is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners.24-DIP (0.300", 7.62mm)RFQ for sourcing$89.991OBSOLETE
Rochester ElectronicsThe 6116LA20SO is an SRAM memory device manufactured by Rochester Electronics. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA20SO is currently in active production through Rochester Electronics's standard distribution channels.24-SOIC (0.295", 7.50mm Width)1.806 In Stock$2.621ACTIVE
RenesasThe 6116LA20SOG is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA20SOG is currently in active production through Renesas's standard distribution channels.24-SOIC (0.295", 7.50mm Width)3.882 In Stock$5.791ACTIVE
RenesasThe 6116LA20SOG8 is an SRAM memory device manufactured by Renesas. Key technical specifications include 16Kb (2K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 6116LA20SOG8 is currently in active production through Renesas's standard distribution channels.24-SOIC (0.295", 7.50mm Width)5.652 In Stock$5.581ACTIVE
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