| AGID023R31B1I2V | System On Chip (SoC) | AGID023R31B1I2V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for -40°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 2.068 | $88544.16 | ACTIVE | RFQ |
| AGID023R31B2E1V | System On Chip (SoC) | AGID023R31B2E1V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 480 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for 0°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 2.570 | $73788.55 | ACTIVE | RFQ |
| AGID023R31B2E2V | System On Chip (SoC) | AGID023R31B2E2V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 480 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for 0°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 2.348 | $64562.03 | ACTIVE | RFQ |
| AGID023R31B2E3E | System On Chip (SoC) | AGID023R31B2E3E is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 480 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for 0°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 1.505 | $64562.03 | ACTIVE | RFQ |
| AGID023R31B2E3V | System On Chip (SoC) | AGID023R31B2E3V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 480 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for 0°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 1.844 | $55338.12 | ACTIVE | RFQ |
| AGID023R31B2I1V | System On Chip (SoC) | AGID023R31B2I1V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for -40°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 1.243 | $88544.16 | ACTIVE | RFQ |
| AGID023R31B2I2V | System On Chip (SoC) | AGID023R31B2I2V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 480 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for -40°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 1.400 | $77474.00 | ACTIVE | RFQ |
| AGID023R31B2I3E | System On Chip (SoC) | AGID023R31B2I3E is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for -40°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 1.119 | $77474.30 | ACTIVE | RFQ |
| AGID023R31B2I3V | System On Chip (SoC) | AGID023R31B2I3V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 480 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 3184-BFBGA Exposed Pad package, rated for -40°C ~ 100°C (TJ), part of the Agilex I series. | 3184-BFBGA Exposed Pad | 939 | $66408.43 | ACTIVE | RFQ |
| AGID041R29D2E3V | System On Chip (SoC) | AGID041R29D2E3V is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point device by Intel, featuring 256kB RAM, 1.4GHz operating frequency, 720 I/O, with EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, in 2957-BFBGA Exposed Pad package, rated for 0°C ~ 100°C (TJ), part of the Agilex I series. | 2957-BFBGA Exposed Pad | 1.192 | $95462.02 | ACTIVE | RFQ |
| AN87C196JR | Microcontrollers (MCU) | AN87C196JR is a 87C196JR device by Intel, featuring 16KB (16K x 8) Flash, 512 x 8 RAM, 16MHz operating frequency, 41 I/O, with CANbus, Serial Port, SSIO, UART/USART connectivity, in 52-LCC (J-Lead) package, rated for -40°C ~ 125°C (TA), part of the 87C196JR series. | 52-LCC (J-Lead) | 36.978 | $4.50 | ACTIVE | RFQ |
| AN87C196JV20F8 | Microcontrollers (MCU) | AN87C196JV20F8 is a MCS 96 device by Intel, featuring 48KB (48K x 8) Flash, 1.5K x 8 RAM, 20MHz operating frequency, 41 I/O, with SIO connectivity, in 52-LCC (J-Lead) package, rated for -40°C ~ 125°C (TA). This part is discontinued. FPGACenter specializes in sourcing obsolete components. | 52-LCC (J-Lead) | 1.503 | $28.08 | OBSOLETE | RFQ |
| AN87C196LA20F8 | Microcontrollers (MCU) | AN87C196LA20F8 is a MCS 96 device by Intel, featuring 24KB (24K x 8) Flash, 768 x 8 RAM, 20MHz operating frequency, 41 I/O, with SIO connectivity, in 52-LCC (J-Lead) package, rated for -40°C ~ 125°C (TA). This part is discontinued. FPGACenter specializes in sourcing obsolete components. | 52-LCC (J-Lead) | 1.600 | $19.51 | OBSOLETE | RFQ |
| AT80573JH0366M S LBB3 | Microcontrollers (MCU) | AT80573JH0366M S LBB3 by Intel. This part is discontinued. FPGACenter specializes in sourcing obsolete components. | — | 4.962 | $688.00 | OBSOLETE | RFQ |
| AT80574JH046NT S LBBT | Microprocessors (MPU) | AT80574JH046NT S LBBT is a Intel® Xeon® Processor L5408 device by Intel, 2.13GHz operating frequency, rated for 72°C (TC), part of the Intel® Xeon® series. This part is discontinued. FPGACenter specializes in sourcing obsolete components. | — | 66 | RFQ | OBSOLETE | RFQ |
| AT80601000897AB | Microprocessors (MPU) | AT80601000897AB is a Intel® Xeon® Processor W3530 device by Intel, 2.8GHz operating frequency, in 1366-LGA package, rated for 67.9°C (TC). This part is discontinued. FPGACenter specializes in sourcing obsolete components. | 1366-LGA | 1.354 | RFQ | OBSOLETE | RFQ |
| AT80602000801AA S LBF9 | Microprocessors (MPU) | AT80602000801AA S LBF9 is a Intel® Xeon® Processor E5504 device by Intel, 2GHz operating frequency, in 1366-LGA package, rated for 76°C (TC), part of the Intel® Xeon® series. This part is discontinued. FPGACenter specializes in sourcing obsolete components. | 1366-LGA | 7.580 | $3232.94 | OBSOLETE | RFQ |
| AXX6SASDB | Interface Modules | Interface Modules Intel Server Accesso ry AXX6SASDBOEM | — | 1.786 | $390.62 | ACTIVE | RFQ |
| BD-NVV-N3000-2 | Specialized ICs | BD-NVV-N3000-2 by Intel, featuring 8GB memory, with PCI Express interface, rated for 95°C. This part is discontinued. FPGACenter specializes in sourcing obsolete components. | — | 2.140 | RFQ | OBSOLETE | RFQ |
| CYCLONE 10 GX | Microcontrollers (MCU) | PROTOTYPE | — | 2.848 | RFQ | ACTIVE | RFQ |