| W25Q128BVFJP | Flash Memory | The W25Q128BVFJP is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFJP is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128BVFJP TR | Flash Memory | The W25Q128BVFJP TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFJP TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVFSG | Flash Memory | The W25Q128BVFSG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFSG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 16-SOIC (0.295", 7.50mm Width) | 10 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVAIG | Flash Memory | The W25Q128FVAIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVAIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVAIG TR | Flash Memory | The W25Q128FVAIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVAIG TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $1.83 | OBSOLETE | RFQ |
| W25Q128FVAIQ TR | Flash Memory | The W25Q128FVAIQ TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVAIQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $1.83 | OBSOLETE | RFQ |
| W25Q128FVBAG | Flash Memory | The W25Q128FVBAG is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBAG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 2.553 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVBAQ | Flash Memory | The W25Q128FVBAQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 10 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVBBQ | Flash Memory | The W25Q128FVBBQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBBQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 1.867 In Stock | $89.99 | LASTBUY | RFQ |
| W25Q128FVBIG | General Memory ICs | The W25Q128FVBIG is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | $8.10 | OBSOLETE | RFQ |
| W25Q128FVBIP | General Memory ICs | The W25Q128FVBIP is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBIP is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVBJQ | General Memory ICs | The W25Q128FVBJQ is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBJQ is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVBJQ TR | General Memory ICs | The W25Q128FVBJQ TR is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVBJQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVCAQ | Flash Memory | The W25Q128FVCAQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 10 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVCBQ | Flash Memory | The W25Q128FVCBQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCBQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 4.284 In Stock | $89.99 | LASTBUY | RFQ |
| W25Q128FVCIF | General Memory ICs | The W25Q128FVCIF is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCIF is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVCIG | General Memory ICs | The W25Q128FVCIG is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | $1.07 | OBSOLETE | RFQ |
| W25Q128FVCIG TR | General Memory ICs | The W25Q128FVCIG TR is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCIG TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | $0.3240 | OBSOLETE | RFQ |
| W25Q128FVCIP | General Memory ICs | The W25Q128FVCIP is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCIP is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVCJF | General Memory ICs | The W25Q128FVCJF is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCJF is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |