| W25Q16FWUUAQ | Flash Memory | The W25Q16FWUUAQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUUAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-UFDFN Exposed Pad | 10 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWUUBQ | Flash Memory | The W25Q16FWUUBQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUUBQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-UFDFN Exposed Pad | 1.836 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWUUIG TR | Flash Memory | The W25Q16FWUUIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUUIG TR is currently in active production through Winbond Electronics's standard distribution channels. | 8-UFDFN Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| W25Q16FWUUIQ | Flash Memory | The W25Q16FWUUIQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUUIQ is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-UFDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q16FWUUIQ TR | Flash Memory | The W25Q16FWUUIQ TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUUIQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-UFDFN Exposed Pad | RFQ for sourcing | $0.7394 | OBSOLETE | RFQ |
| W25Q16FWUUSQ | Flash Memory | The W25Q16FWUUSQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUUSQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-UFDFN Exposed Pad | 74 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWUXAQ | Flash Memory | The W25Q16FWUXAQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUXAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-UFDFN Exposed Pad | 2.220 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWUXIE | Flash Memory | The W25Q16FWUXIE is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUXIE is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-UFDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q16FWUXIE TR | Flash Memory | The W25Q16FWUXIE TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUXIE TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-UFDFN Exposed Pad | RFQ for sourcing | $0.7250 | OBSOLETE | RFQ |
| W25Q16FWUXSQ | Flash Memory | The W25Q16FWUXSQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWUXSQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-UFDFN Exposed Pad | 1.792 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWZPAQ | Flash Memory | The W25Q16FWZPAQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWZPAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-WDFN Exposed Pad | 31 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWZPBQ | Flash Memory | The W25Q16FWZPBQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWZPBQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-WDFN Exposed Pad | 66 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16FWZPIQ | Flash Memory | The W25Q16FWZPIQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWZPIQ is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q16FWZPIQ TR | Flash Memory | The W25Q16FWZPIQ TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWZPIQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $0.4860 | OBSOLETE | RFQ |
| W25Q16FWZPSQ | Flash Memory | The W25Q16FWZPSQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16FWZPSQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-WDFN Exposed Pad | 48 In Stock | RFQ | LASTBUY | RFQ |
| W25Q16JLSNIG | Flash Memory | The W25Q16JLSNIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JLSNIG is currently in active production through Winbond Electronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 36.000 In Stock | $0.4401 | ACTIVE | RFQ |
| W25Q16JLSNIG TR | Flash Memory | The W25Q16JLSNIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JLSNIG TR is currently in active production through Winbond Electronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 49.656 In Stock | $0.3870 | ACTIVE | RFQ |
| W25Q16JLSSIG TR | Flash Memory | The W25Q16JLSSIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.209", 5.30mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JLSSIG TR is currently in active production through Winbond Electronics's standard distribution channels. | 8-SOIC (0.209", 5.30mm Width) | 4.350 In Stock | $89.99 | ACTIVE | RFQ |
| W25Q16JLZPIG | Flash Memory | The W25Q16JLZPIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JLZPIG is currently in active production through Winbond Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 2.240 In Stock | $1.16 | ACTIVE | RFQ |
| W25Q16JLZPIG TR | Flash Memory | The W25Q16JLZPIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JLZPIG TR is currently in active production through Winbond Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 744 In Stock | $1.76 | ACTIVE | RFQ |