HTEE25608

Active
865 In Stock
Package56-BCPGA
MountThrough Hole
Lifecycleactive
ManufacturerHoneywell

Technical Specifications

CategoryIntegrated Circuits (ICs)/Memory Integrated Circuit
Product StatusActive
Operating Temperature-55°C ~ 225°C (TA)
Mounting TypeThrough Hole
Package / Case56-BCPGA
TechnologyEEPROM
Supplier Device Package56-CPGA
Memory Size256Kb (32K x 8)
Memory TypeNon-Volatile
Voltage - Supply4.75V ~ 5.25V
Clock Frequency5 MHz
Access Time150 ns
Memory FormatEEPROM
Memory InterfaceParallel, SPI
Write Cycle Time - Word, Page90ms
E U Ro H S StatusRoHS Compliant
M S L Rating1 (Unlimited, 30°C/85%RH)
U S E C C NEAR99
H T S U S8542.32.0051
R E A C H StatusREACH is not affected
China Ro H S StatusGreen Symbol: Green and environmentally friendly product

Product Overview

The HTEE25608 is a eeprom in the Non-Volatile Memory family manufactured by Honeywell. This component is currently in active production.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Active, Operating Temperature: -55°C ~ 225°C (TA), Mounting Type: Through Hole, Package / Case: 56-BCPGA.

This device comes in a 56-BCPGA package with through hole mounting.

FPGACenter currently has 865 units of HTEE25608 in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Is the HTEE25608 in stock and ready to ship?

Yes, FPGACenter currently has 865 units of HTEE25608 in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the HTEE25608 available in?

The HTEE25608 by Honeywell is available in a 56-BCPGA package with through hole mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

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