MU82645DES

HC20K600FC672

The HC20K600FC672 is an FPGA manufactured by Intel. Key technical specifications include 24320 logic elements, 600000 gates, 1.71V ~ 1.89V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the HC20K600FC672 is no longer produced by Intel; FPGACenter maintains verified stock sourced through certified supply chain partners.

KC80526GY650256

The KC80526GY650256 is a microprocessor manufactured by Intel, part of the Mobile Pentium III series. Technical highlights include 650MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 495-BGA package and is rated for operation across 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the KC80526GY650256 is currently in active production through Intel's standard distribution channels.

EG87C51RC24

The EG87C51RC24 is a microcontroller manufactured by Intel, part of the 87C series. Key technical specifications include 32KB (32K x 8) Flash memory, 512 x 8 RAM, 24MHz clock speed, and SIO connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 44-QFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the EG87C51RC24 is currently in active production through Intel's standard distribution channels.

LF80538GF0282M

The LF80538GF0282M is a microprocessor manufactured by Intel, part of the T1300 series. Technical highlights include 1.66GHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Through Hole component is supplied in a 478-PGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the LF80538GF0282M is currently in active production through Intel's standard distribution channels.

ER3105DI

The ER3105DI is a DC-DC converter manufactured by Intel. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 12-VFDFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the ER3105DI is no longer produced by Intel; FPGACenter maintains verified stock sourced through certified supply chain partners.

AN87C196JR

The AN87C196JR is a microcontroller manufactured by Intel, part of the 87C196JR series. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 16MHz clock speed, and CANbus, Serial Port, SSIO, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 52-LCC (J-Lead) package and is rated for operation across -40°C ~ 125°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the AN87C196JR is currently in active production through Intel's standard distribution channels.