A3P400-1FGG256

A3PN125-Z2VQG100

The A3PN125-Z2VQG100 is an FPGA manufactured by Microsemi. Key technical specifications include 125000 gates, 1.425V ~ 1.575V supply voltage, and -20°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -20°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PN125-Z2VQG100 is currently in active production through Microsemi's standard distribution channels.

AX500-FG676I

The AX500-FG676I is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FG676I is currently in active production through Microsemi's standard distribution channels.

A3P250-2QNG132

The A3P250-2QNG132 is an FPGA manufactured by Microsemi. Key technical specifications include 250000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 132-WFQFN package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P250-2QNG132 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.

APA450-FG256

The APA450-FG256 is an FPGA manufactured by Microsemi. Key technical specifications include 450000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA450-FG256 is currently in active production through Microsemi's standard distribution channels.

APA750-FGG896I

The APA750-FGG896I is an FPGA manufactured by Microsemi. Key technical specifications include 750000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA750-FGG896I is currently in active production through Microsemi's standard distribution channels.

A3P1000L-FG256

The A3P1000L-FG256 is an FPGA manufactured by Microsemi. Key technical specifications include 1000000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P1000L-FG256 is currently in active production through Microsemi's standard distribution channels.