H26M78208CMRN

Active
767 In Stock
Package153-BGA
MountSurface Mount
Lifecycleactive
ManufacturerNetlist Inc.

Technical Specifications

CategoryIntegrated Circuits (ICs)/Memory Integrated Circuit
Product StatusActive
Operating Temperature-25°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case153-BGA
TechnologyFLASH - NAND (SLC)
Supplier Device Package153-FBGA (11.5x13)
Memory Size512Gbit
Memory TypeNon-Volatile
Voltage - Supply2.7V ~ 3.6V
Clock Frequency200 MHz
Memory FormatFlash
Memory InterfaceeMMC_5.1
Memory Organization64G x 8
PackagingTape & Reel (TR)
E U Ro H S StatusRoHS Compliant
M S L Rating3 (168 Hours,30°C/60%RH)
R E A C H StatusREACH Affected
U S E C C NEAR99
H T S U S8542.32.0051
China Ro H S StatusGreen Symbol: Green and environmentally friendly product

Product Overview

The H26M78208CMRN is a general memory ics in the Other Memory family manufactured by Netlist Inc.. This component is currently in active production.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Active, Operating Temperature: -25°C ~ 85°C (TA), Mounting Type: Surface Mount, Package / Case: 153-BGA.

This device comes in a 153-BGA package with surface mount mounting.

FPGACenter currently has 767 units of H26M78208CMRN in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Is the H26M78208CMRN in stock and ready to ship?

Yes, FPGACenter currently has 767 units of H26M78208CMRN in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the H26M78208CMRN available in?

The H26M78208CMRN by Netlist Inc. is available in a 153-BGA package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

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