BD1HCU50EFJ-CE2
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* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.
Technical Specifications
| Category | Integrated Circuits (ICs)/Power Distribution Switches, Load Drivers |
| Product Status | Active |
| Operating Temperature | -40°C ~ 150°C |
| Features | Latch Function, Slew Rate Controlled |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Input Type | Non-Inverting |
| Output Type | N-Channel |
| Supplier Device Package | 8-HTSOP-J |
| Ratio - Input: Output | 1:1 |
| Voltage - Supply ( Vcc/ Vdd) | Not Required |
| Number of Outputs | 1 |
| Fault Protection | Current Limiting (Fixed), Over Temperature, Reverse Battery, Short Circuit, UVLO |
| Output Configuration | High Side |
| Rds On ( Typ) | 500mOhm |
| Voltage - Load | 4V ~ 18V |
| Current - Output ( Max) | 1.45A |
| Switch Type | General Purpose |
| Series | Automotive, AEC-Q100 |
| Base Product Number | BD1HCU50 |
| Packaging | Tape & Reel (TR) |
| M S L Rating | 1 (Unlimited, 30°C/85%RH) |
| R E A C H Status | REACH Unaffected |
| E U Ro H S Status | RoHS Compliant |
| U S E C C N | EAR99 |
| China Ro H S Status | Green Symbol: Green and environmentally friendly product |
Product Overview
The BD1HCU50EFJ-CE2 is a power distribution switches in the Power Switches & Distribution family manufactured by ROHM Semiconductor. This component is currently in active production.
Key specifications include Category: Integrated Circuits (ICs)/Power Distribution Switches, Load Drivers, Product Status: Active, Operating Temperature: -40°C ~ 150°C, Features: Latch Function, Slew Rate Controlled, Mounting Type: Surface Mount.
This device comes in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package with surface mount mounting.
FPGACenter currently has 14.220 units of BD1HCU50EFJ-CE2 in stock, available for immediate shipment with no minimum order quantity.
Application Areas
Frequently Asked Questions
Is the BD1HCU50EFJ-CE2 in stock and ready to ship?
Yes, FPGACenter currently has 14.220 units of BD1HCU50EFJ-CE2 in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the BD1HCU50EFJ-CE2 available in?
The BD1HCU50EFJ-CE2 by ROHM Semiconductor is available in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.
What is the pricing for BD1HCU50EFJ-CE2?
Unit pricing for BD1HCU50EFJ-CE2 starts at $1.19 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.