Integrated Circuits (ICs)/DSP (Digital Signal Processors)
Product Status
Not For New Designs
Operating Temperature
0°C ~ 90°C (TC)
Mounting Type
Surface Mount
Package / Case
384-FBGA, FCCSPBGA
Type
Fixed Point
Interface
McBSP
Supplier Device Package
384-FC/CSP (18x18)
Clock Rate
300MHz
Non- Volatile Memory
External
On- Chip R A M
896kB
Voltage - I/ O
3.30V
Voltage - Core
1.50V
E U Ro H S Status
RoHS Compliant
R E A C H Status
Vendor is not defined
U S E C C N
Provided as per user requirements
China Ro H S Status
Green Symbol: Green and environmentally friendly product
Product Overview
The BBN6203BGNY30C is a dsp - digital signal processors in the Microcontrollers & Processors family manufactured by Texas Instruments. This component is currently in active production.
Key specifications include Category: Integrated Circuits (ICs)/DSP (Digital Signal Processors), Product Status: Not For New Designs, Operating Temperature: 0°C ~ 90°C (TC), Mounting Type: Surface Mount, Package / Case: 384-FBGA, FCCSPBGA.
This device comes in a 384-FBGA, FCCSPBGA package with surface mount mounting.
FPGACenter currently has 623 units of BBN6203BGNY30C in stock, available for immediate shipment with no minimum order quantity.
Yes, FPGACenter currently has 623 units of BBN6203BGNY30C in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the BBN6203BGNY30C available in?
The BBN6203BGNY30C by Texas Instruments is available in a 384-FBGA, FCCSPBGA package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.
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