TE0830-01-ABI26FAP

Active
2.581 In Stock
PackageN/A
MountN/A
Lifecycleactive
ManufacturerTrenz Electronic

Technical Specifications

CategoryIntegrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
Product StatusActive
Operating Temperature-40°C ~ 85°C
Size / Dimension4.724" L x 4.724" W (120.00mm x 120.00mm)
Connector Type2 x 400 Pin
Module/ Board TypeMPU Core
Core ProcessorZynq UltraScale+ ZU11EG-1I
Flash Size128MB
R A M Size16GB
SeriesZynq® UltraScale+™
PackagingBulk
E U Ro H S StatusROHS3 Compliant
M S L RatingVendor omitted MSL Rating information
R E A C H StatusREACH is not affected
U S E C C NEAR99
China Ro H S StatusGreen Symbol: Green and environmentally friendly product

Product Overview

The TE0830-01-ABI26FAP is a system on chip (soc) in the Microcontrollers & Processors family manufactured by Trenz Electronic. This component is currently in active production.

Key specifications include Category: Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules, Product Status: Active, Operating Temperature: -40°C ~ 85°C, Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm), Connector Type: 2 x 400 Pin.

FPGACenter currently has 2.581 units of TE0830-01-ABI26FAP in stock, available for immediate shipment with no minimum order quantity.

Application Areas

IoT & Smart DevicesConsumer ElectronicsIndustrial AutomationAutomotive ElectronicsWearable Technology

Frequently Asked Questions

Is the TE0830-01-ABI26FAP in stock and ready to ship?

Yes, FPGACenter currently has 2.581 units of TE0830-01-ABI26FAP in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

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