TS-1109S

Active
1.000.000 In Stock
MOQ: 100
Package6x6x5mm
MountThrough-Hole
Lifecycleactive
ManufacturerXUNPU

Pricing

1+
$0.0150
10+
$0.0138
100+
$0.0123
500+
$0.0108
1000+
$0.0097
5000+
$0.0087

* Estimated pricing for reference only. Final price depends on quantity, availability, and market conditions. Submit an RFQ for an exact quote.

Technical Specifications

ManufacturerXUNPU
Package / Case6x6x5mm
Mounting TypeThrough-Hole
Ro H S StatusROHS3 Compliant
Moisture Sensitivity Level ( M S L)3 (168 Hours)
Lifecycle StatusActive
Operating Temperature-40°C ~ 85°C (TA)

Product Overview

The TS-1109S is a electronic component manufactured by XUNPU. This component is currently in active production.

Key specifications include Manufacturer: XUNPU, Package / Case: 6x6x5mm, Mounting Type: Through-Hole, Ro H S Status: ROHS3 Compliant, Moisture Sensitivity Level ( M S L): 3 (168 Hours).

This device comes in a 6x6x5mm package with through-hole mounting.

FPGACenter currently has 1.000.000 units of TS-1109S in stock, available for immediate shipment with no minimum order quantity.

Application Areas

Industrial AutomationConsumer ElectronicsTelecommunicationsAutomotive ElectronicsIoT & Smart Devices

Frequently Asked Questions

Is the TS-1109S in stock and ready to ship?

Yes, FPGACenter currently has 1.000.000 units of TS-1109S in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.

What package type is the TS-1109S available in?

The TS-1109S by XUNPU is available in a 6x6x5mm package with through-hole mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

What is the pricing for TS-1109S?

Unit pricing for TS-1109S starts at $0.0150 with volume discounts available for quantities of 10+, 100+, 500+, and 1,000+ units. Submit an RFQ for a customized quote based on your specific quantity requirements.

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