Find Analog & Mixed Signal from Rochester, Texas Instruments, and additional brands. 88,903 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
The TLE2161BMJG is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -55°C ~ 125°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-CDIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2161BMJG is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161CD is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2161CD is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161CDG4 is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2161CDG4 is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161ID is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2161ID is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161IDG4 is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2161IDG4 is currently in active production through Texas Instruments's standard distribution channels.
The TLE2161IDR is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2161IDR is currently in active production through Texas Instruments's standard distribution channels.
The TLE2161IDRG4 is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2161IDRG4 is currently in active production through Texas Instruments's standard distribution channels.
The TLE2161IP is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2161IP is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161MJGB is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -55°C ~ 125°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-CDIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2161MJGB is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161MLB is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -55°C ~ 125°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a TO-99-8 Metal Can package and is rated for operation across -55°C ~ 125°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2161MLB is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2161MP is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -55°C ~ 125°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2161MP is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2237CDW is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2237CDW is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2301INE is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2301INE is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2301INEE4 is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLE2301INEE4 is currently in active production through Texas Instruments's standard distribution channels.
The TLE26621DWR is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE26621DWR is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2662IDW is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the TLE2662IDW is currently in active production through Rochester Electronics's standard distribution channels.
The TLE2662IDWR is an instrumentation amplifier manufactured by Rochester Electronics. Design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLE2662IDWR is currently in active production through Rochester Electronics's standard distribution channels.
The TLP7820(A,E is an application-specific IC manufactured by Toshiba Semiconductor and Storage. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLP7820(A,E is no longer produced by Toshiba Semiconductor and Storage; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLP7820(A,TL,E is an application-specific IC manufactured by Toshiba Semiconductor and Storage. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLP7820(A,TL,E is no longer produced by Toshiba Semiconductor and Storage; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLP7820(A-LF4,E is an application-specific IC manufactured by Toshiba Semiconductor and Storage. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLP7820(A-LF4,E is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.