Find Analog & Mixed Signal from Rochester, Texas Instruments, and additional brands. 88,903 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
The TLV2633IDR is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2633IDR is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2633IN is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 70°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 14-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 70°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2633IN is currently in active production through Rochester Electronics's standard distribution channels.
The TLV2634ID is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2634ID is currently in active production through Texas Instruments's standard distribution channels.
The TLV2634IDR is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2634IDR is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2634IN is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 70°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 14-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 70°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2634IN is currently in active production through Rochester Electronics's standard distribution channels.
The TLV2634IPW is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2634IPW is currently in active production through Rochester Electronics's standard distribution channels.
The TLV2634IPWR is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2634IPWR is currently in active production through Texas Instruments's standard distribution channels.
The TLV2635ID is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2635ID is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2635IDG4 is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2635IDG4 is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2635IDR is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2635IDR is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2635IN is an instrumentation amplifier manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2635IN is currently in active production through Rochester Electronics's standard distribution channels.
The TLV2635IPWR is an instrumentation amplifier manufactured by Texas Instruments. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 16-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the TLV2635IPWR is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2702ID is an application-specific IC manufactured by Rochester Electronics. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2702ID is currently in active production through Rochester Electronics's standard distribution channels.
The TLV2702IDG4 is an application-specific IC manufactured by Texas Instruments. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2702IDG4 is currently in active production through Texas Instruments's standard distribution channels.
The TLV2702IDGK is an application-specific IC manufactured by Rochester Electronics. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2702IDGK is currently in active production through Rochester Electronics's standard distribution channels.
The TLV2702IDGKG4 is an application-specific IC manufactured by Texas Instruments. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2702IDGKG4 is currently in active production through Texas Instruments's standard distribution channels.
The TLV2702IDGKR is an application-specific IC manufactured by Texas Instruments. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2702IDGKR is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.
The TLV2702IP is an application-specific IC manufactured by Texas Instruments. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2702IP is currently in active production through Texas Instruments's standard distribution channels.
The TLV2704ID is an application-specific IC manufactured by Texas Instruments. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2704ID is currently in active production through Texas Instruments's standard distribution channels.
The TLV2704IN is an application-specific IC manufactured by Rochester Electronics. Design review should confirm supply voltage, interface compatibility, package fit, operating temperature limits, and lot/date code traceability, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 14-DIP (0.300", 7.62mm) package suitable for both prototyping and production builds. Designed for audio systems, instrumentation, and medical devices applications, the TLV2704IN is currently in active production through Rochester Electronics's standard distribution channels.