Component category
FPGAs & Programmable Logic
31,003 FPGAs & Programmable Logic parts in stock from Altera, Lattice, and other major brands. Including 1152-BBGA, FCBGA options. No MOQ, fast global shipping.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Xilinx | The XCVU190-2FLGB2104I is an FPGA manufactured by Xilinx. Key technical specifications include 2349900 logic elements, 134280 LABs/CLBs, 0.922V ~ 0.979V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 2104-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU190-2FLGB2104I is currently in active production through Xilinx's standard distribution channels. | 2104-BBGA, FCBGA | 1,210 In Stock | $94580.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU190-2FLGC2104E is an FPGA manufactured by Xilinx. Key technical specifications include 2349900 logic elements, 134280 LABs/CLBs, 0.922V ~ 0.979V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 2104-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU190-2FLGC2104E is currently in active production through Xilinx's standard distribution channels. | 2104-BBGA, FCBGA | 2,010 In Stock | $85885.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU190-3FLGA2577E is an FPGA manufactured by Xilinx. Key technical specifications include 2349900 logic elements, 134280 LABs/CLBs, 0.970V ~ 1.030V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 2577-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU190-3FLGA2577E is currently in active production through Xilinx's standard distribution channels. | 2577-BBGA, FCBGA | 2,100 In Stock | $135932.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU190-3FLGB2104E is an FPGA manufactured by Xilinx. Key technical specifications include 2349900 logic elements, 134280 LABs/CLBs, 0.970V ~ 1.030V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 2104-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU190-3FLGB2104E is currently in active production through Xilinx's standard distribution channels. | 2104-BBGA, FCBGA | 1,727 In Stock | $115272.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU190-3FLGC2104E is an FPGA manufactured by Xilinx. Key technical specifications include 2349900 logic elements, 134280 LABs/CLBs, 0.970V ~ 1.030V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 2104-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU190-3FLGC2104E is currently in active production through Xilinx's standard distribution channels. | 2104-BBGA, FCBGA | 1,662 In Stock | $119622.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU19P-1FSVB3824E is an FPGA manufactured by Xilinx, part of the Virtex® UltraScale+™ series. Key technical specifications include 8937600 logic elements, 510720 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 3824-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU19P-1FSVB3824E is currently in active production through Xilinx's standard distribution channels. | 3824-BBGA, FCBGA | 770 In Stock | $157122.86 | 1 | ACTIVE | ||
| Xilinx | The XCVU19P-2FSVA3824E is an FPGA manufactured by Xilinx. Key technical specifications include 8937600 logic elements, 510720 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 3824-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU19P-2FSVA3824E is currently in active production through Xilinx's standard distribution channels. | 3824-BBGA, FCBGA | 1,538 In Stock | $9864.85 | 1 | ACTIVE | ||
| Xilinx | The XCVU19P-2FSVB3824E is an FPGA manufactured by Xilinx. Key technical specifications include 8937600 logic elements, 510720 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 3824-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU19P-2FSVB3824E is currently in active production through Xilinx's standard distribution channels. | 3824-BBGA, FCBGA | 2,912 In Stock | $192490.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-1FSVJ1760E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1760-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-1FSVJ1760E is currently in active production through Xilinx's standard distribution channels. | 1760-BBGA, FCBGA | 1,126 In Stock | $94827.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-1FSVJ1760I is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1760-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-1FSVJ1760I is currently in active production through Xilinx's standard distribution channels. | 1760-BBGA, FCBGA | 2,744 In Stock | $118535.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-1VSVA1365E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1365-BFBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-1VSVA1365E is currently in active production through Xilinx's standard distribution channels. | 1365-BFBGA, FCBGA | 2,042 In Stock | $74510.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-1VSVA1365I is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1365-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-1VSVA1365I is currently in active production through Xilinx's standard distribution channels. | 1365-BFBGA, FCBGA | 2,936 In Stock | $93137.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-2FSVJ1760E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1760-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-2FSVJ1760E is currently in active production through Xilinx's standard distribution channels. | 1760-BBGA, FCBGA | 1,407 In Stock | $132767.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-2FSVJ1760I is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1760-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-2FSVJ1760I is currently in active production through Xilinx's standard distribution channels. | 1760-BBGA, FCBGA | 1,186 In Stock | $151725.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-2VSVA1365E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1365-BFBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-2VSVA1365E is currently in active production through Xilinx's standard distribution channels. | 1365-BFBGA, FCBGA | 2,028 In Stock | $104320.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-2VSVA1365I is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.825V ~ 0.876V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1365-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-2VSVA1365I is currently in active production through Xilinx's standard distribution channels. | 1365-BFBGA, FCBGA | 1,970 In Stock | $119215.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-3FSVJ1760E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.873V ~ 0.927V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1760-BBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-3FSVJ1760E is currently in active production through Xilinx's standard distribution channels. | 1760-BBGA, FCBGA | 2,318 In Stock | $181216.70 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-3VSVA1365E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.873V ~ 0.927V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1365-BFBGA, FCBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-3VSVA1365E is currently in active production through Xilinx's standard distribution channels. | 1365-BFBGA, FCBGA | 2,727 In Stock | $145292.50 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-L2FSVJ1760E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.698V ~ 0.742V supply voltage, and 0°C ~ 110°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1760-BBGA, FCBGA package and is rated for operation across 0°C ~ 110°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-L2FSVJ1760E is currently in active production through Xilinx's standard distribution channels. | 1760-BBGA, FCBGA | 2,181 In Stock | $151725.00 | 1 | ACTIVE | ||
| Xilinx | The XCVU23P-L2VSVA1365E is an FPGA manufactured by Xilinx. Key technical specifications include 2252250 logic elements, 128700 LABs/CLBs, 0.698V ~ 0.742V supply voltage, and 0°C ~ 110°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1365-BFBGA, FCBGA package and is rated for operation across 0°C ~ 110°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCVU23P-L2VSVA1365E is currently in active production through Xilinx's standard distribution channels. | 1365-BFBGA, FCBGA | 1,578 In Stock | $119215.00 | 1 | ACTIVE |