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Component category

Power Distribution Switches

Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Rochester ElectronicsThe MC20XS4200BFK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200BFK is currently in active production through Rochester Electronics's standard distribution channels.23-PowerQFN2.316 In StockRFQ1ACTIVE
NXP SemiconductorsThe MC20XS4200BFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200BFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcing$19.781OBSOLETE
NXP SemiconductorsThe MC20XS4200DFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200DFK is currently in active production through NXP Semiconductors's standard distribution channels.Check1.058 In Stock$11.181ACTIVE
NXP SemiconductorsThe MC20XS4200DFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200DFKR2 is currently in active production through NXP Semiconductors's standard distribution channels.Check1.747 In Stock$13.811ACTIVE
NXP SemiconductorsThe MC20XS4200FK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200FK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcing$18.911OBSOLETE
NXP SemiconductorsThe MC20XS4200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcing$19.781OBSOLETE
NXP SemiconductorsThe MC22XS4200BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC22XS4200BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$17.471OBSOLETE
NXP SemiconductorsThe MC22XS4200CEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200CEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$20.541OBSOLETE
NXP SemiconductorsThe MC22XS4200CEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200CEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$17.471OBSOLETE
NXP SemiconductorsThe MC22XS4200DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 32-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200DEK is currently in active production through NXP Semiconductors's standard distribution channels.Check572 In Stock$14.001ACTIVE
NXP SemiconductorsThe MC22XS4200DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels.32-SSOP (0.295", 7.50mm Width) Exposed Pad2.388 In Stock$12.901ACTIVE
Rochester ElectronicsThe MC22XSD200BEK-NXP is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XSD200BEK-NXP is currently in active production through Rochester Electronics's standard distribution channels.Check1.070 In Stock$15.461ACTIVE
NXP SemiconductorsThe MC22XSD200BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XSD200BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$17.471OBSOLETE
NXP SemiconductorsThe MC25XS6300BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC25XS6300BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC25XS6300EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC25XS6300EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$6.851OBSOLETE
NXP SemiconductorsThe MC25XS6300EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC25XS6300EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$9.551OBSOLETE
MC33143DW
Freescale SemiconductorThe MC33143DW is a power distribution IC manufactured by Freescale Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC33143DW is no longer produced by Freescale Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.24-SOIC (0.295", 7.50mm Width)RFQ for sourcing$8.491OBSOLETE
MC33288DDH
Freescale SemiconductorThe MC33288DDH is a power distribution IC manufactured by Freescale Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.433", 11.00mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC33288DDH is no longer produced by Freescale Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.20-SOIC (0.433", 11.00mm Width) Exposed PadRFQ for sourcing$16.101OBSOLETE
Freescale SemiconductorThe MC33288DDHR2 is a power distribution IC manufactured by Freescale Semiconductor. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.433", 11.00mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC33288DDHR2 is no longer produced by Freescale Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.20-SOIC (0.433", 11.00mm Width) Exposed PadRFQ for sourcing$16.521OBSOLETE
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