Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| STMicroelectronics | The VB025MSP6-E is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB025MSP6-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB025MSP613TR is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB025MSP613TR is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $10.48 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB025MSP6TR-E is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB025MSP6TR-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB026MSP-E is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB026MSP-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $9.41 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB026MSPTR-E is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB026MSPTR-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $10.77 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027(6) is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a Pentawatt-5 HV (Bent and Staggered Leads) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027(6) is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Pentawatt-5 HV (Bent and Staggered Leads) | RFQ for sourcing | $11.80 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027(6)-11-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a Pentawatt-5 HV (Bent and Staggered Leads) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027(6)-11-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Pentawatt-5 HV (Bent and Staggered Leads) | RFQ for sourcing | $10.75 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027(6)-12 is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a Pentawatt-5 HV (Bent and Staggered Leads) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027(6)-12 is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Pentawatt-5 HV (Bent and Staggered Leads) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027(6)-12-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a Pentawatt-5 HV (Bent and Staggered Leads) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027(6)-12-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Pentawatt-5 HV (Bent and Staggered Leads) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027SP-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027SP-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $8.96 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027SP6 is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027SP6 is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $12.59 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027SP613TR is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027SP613TR is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $10.26 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB027SPTR-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB027SPTR-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $10.26 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB029SP6-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB029SP6-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB029SP6TR-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB029SP6TR-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB125ASP-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB125ASP-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $11.15 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB125ASP6 is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB125ASP6 is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| STMicroelectronics | The VB125ASP613TR is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB125ASP613TR is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $9.76 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB125ASPTR-E is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB125ASPTR-E is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $10.26 | 1 | OBSOLETE | ||
| STMicroelectronics | The VB325SP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a PowerSO-10 Exposed Bottom Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the VB325SP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | PowerSO-10 Exposed Bottom Pad | RFQ for sourcing | $10.45 | 1 | OBSOLETE |