Component category
Power Management
FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The MC10XS6225BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XS6225BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $11.60 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XS6225EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XS6225EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $9.86 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XS6325BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XS6325BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $13.18 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XS6325BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XS6325BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $6.38 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XS6325EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XS6325EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $4.06 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XS6325EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XS6325EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $11.21 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XSC425EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XSC425EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XSD200BFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XSD200BFK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XSD200BFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XSD200BFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The MC10XSD200FK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XSD200FK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $8.58 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC10XSD200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC10XSD200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $25.74 | 1 | OBSOLETE | ||
| Rochester Electronics | The MC1121DMR2 is a DC-DC converter manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for battery-powered devices, portable electronics, and industrial sensors applications, the MC1121DMR2 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 16.782 In Stock | $0.4095 | 1 | ACTIVE | ||
| Rochester Electronics | The MC1364P is a motor driver IC manufactured by Rochester Electronics. Design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for motor control, LED lighting, and display backlight applications, the MC1364P is currently in active production through Rochester Electronics's standard distribution channels. | Check | 1.695 In Stock | $8.05 | 1 | ACTIVE | ||
| Rochester Electronics | The MC13783JVK5 is a specialized power management IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 247-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13783JVK5 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 247-TFBGA | RFQ for sourcing | $16.62 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC13783JVK5R2 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 247-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13783JVK5R2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 247-TFBGA | RFQ for sourcing | $23.44 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC13783VK is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 247-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13783VK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 247-TFBGA | RFQ for sourcing | $23.20 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC13783VK5 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 247-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13783VK5 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 247-TFBGA | RFQ for sourcing | $16.53 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC13783VK5R2 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 247-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13783VK5R2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 247-TFBGA | RFQ for sourcing | $8.59 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC13783VKR2 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 247-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13783VKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 247-TFBGA | RFQ for sourcing | $32.85 | 1 | OBSOLETE | ||
| Rochester Electronics | The MC13892AJVK is a specialized power management IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 139-TFBGA package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC13892AJVK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 139-TFBGA | RFQ for sourcing | $3.26 | 1 | OBSOLETE |