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Component category

Power Management

FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
MIC5800YM
Rochester ElectronicsThe MIC5800YM is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5800YM is currently in active production through Rochester Electronics's standard distribution channels.14-SOIC (0.154", 3.90mm Width)14.874 In Stock$1.151ACTIVE
MicrochipThe MIC5800YM-TR is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5800YM-TR is currently in active production through Microchip's standard distribution channels.14-SOIC (0.154", 3.90mm Width)8.880 In Stock$0.41401ACTIVE
MIC5800YN
Rochester ElectronicsThe MIC5800YN is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 14-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5800YN is currently in active production through Rochester Electronics's standard distribution channels.14-DIP (0.300", 7.62mm)3.300 In Stock$2.561ACTIVE
MIC5801BN
MicrochipThe MIC5801BN is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 22-DIP (0.400", 10.16mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801BN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.22-DIP (0.400", 10.16mm)RFQ for sourcingRFQ1OBSOLETE
MIC5801BV
MicrochipThe MIC5801BV is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801BV is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.28-LCC (J-Lead)RFQ for sourcing$5.251OBSOLETE
Rochester ElectronicsThe MIC5801BV TR is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801BV TR is currently in active production through Rochester Electronics's standard distribution channels.28-LCC (J-Lead)14.220 In Stock$1.041ACTIVE
MIC5801BWM
MicrochipThe MIC5801BWM is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801BWM is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.24-SOIC (0.295", 7.50mm Width)RFQ for sourcing$5.091OBSOLETE
MicrochipThe MIC5801BWM-TR is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801BWM-TR is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.24-SOIC (0.295", 7.50mm Width)RFQ for sourcing$5.851OBSOLETE
MIC5801YN
MicrochipThe MIC5801YN is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 22-DIP (0.400", 10.16mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801YN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.22-DIP (0.400", 10.16mm)RFQ for sourcingRFQ1OBSOLETE
MIC5801YV
MicrochipThe MIC5801YV is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801YV is currently in active production through Microchip's standard distribution channels.28-LCC (J-Lead)3.876 In Stock$2.331ACTIVE
MicrochipThe MIC5801YV-TR is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801YV-TR is currently in active production through Microchip's standard distribution channels.28-LCC (J-Lead)34.666 In Stock$2.321ACTIVE
MIC5801YWM
MicrochipThe MIC5801YWM is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801YWM is currently in active production through Microchip's standard distribution channels.24-SOIC (0.295", 7.50mm Width)10.297 In Stock$2.091ACTIVE
MicrochipThe MIC5801YWM-TR is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5801YWM-TR is currently in active production through Microchip's standard distribution channels.24-SOIC (0.295", 7.50mm Width)10.200 In Stock$3.311ACTIVE
MIC5821BN
MicrochipThe MIC5821BN is a power distribution IC manufactured by Microchip. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5821BN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
MIC5821YN
MicrochipThe MIC5821YN is a power distribution IC manufactured by Microchip. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5821YN is currently in active production through Microchip's standard distribution channels.16-DIP (0.300", 7.62mm)1.504 In Stock$7.701ACTIVE
MIC5822BN
MicrochipThe MIC5822BN is a power distribution IC manufactured by Microchip. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5822BN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
MIC5822YN
MicrochipThe MIC5822YN is a power distribution IC manufactured by Microchip. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5822YN is currently in active production through Microchip's standard distribution channels.16-DIP (0.300", 7.62mm)1.501 In Stock$0.60701ACTIVE
MIC5841BN
MicrochipThe MIC5841BN is a power distribution IC manufactured by Microchip. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5841BN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.18-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
MIC5841BV
Rochester ElectronicsThe MIC5841BV is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5841BV is currently in active production through Rochester Electronics's standard distribution channels.20-LCC (J-Lead)1.543 In Stock$7.141ACTIVE
MicrochipThe MIC5841BV-TR is a power distribution IC manufactured by Microchip. Technical highlights include -55°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -55°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC5841BV-TR is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcing$5.171OBSOLETE
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