Component category
Power Management
FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| ROHM Semiconductor | The BS2103F-E2 is a combinational logic IC manufactured by ROHM Semiconductor. Technical highlights include 10V ~ 18V supply voltage and -40°C ~ 150°C (TJ) operating temperature; design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for motor control, LED lighting, and display backlight applications, the BS2103F-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.173", 4.40mm Width) | RFQ for sourcing | $1.04 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BS2114F-E2 is a combinational logic IC manufactured by ROHM Semiconductor. Technical highlights include 10V ~ 20V supply voltage and -40°C ~ 125°C (TA) operating temperature; design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for motor control, LED lighting, and display backlight applications, the BS2114F-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.173", 4.40mm Width) | RFQ for sourcing | $1.25 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BS2130F-GE2 is a driver IC manufactured by ROHM Semiconductor. Key technical specifications include 11.5V ~ 20V supply voltage, -40°C ~ 125°C (TA) operating temperature, and Logic interface; design review should also confirm drive current, MOSFET or LED load compatibility, and input voltage. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for motor control, LED lighting, and display backlight applications, the BS2130F-GE2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $1.92 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BS2132F-E2 is a combinational logic IC manufactured by ROHM Semiconductor. Technical highlights include 11.5V ~ 20V supply voltage and -40°C ~ 125°C (TA) operating temperature; design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for motor control, LED lighting, and display backlight applications, the BS2132F-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $9.00 | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP452 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP452 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | $4.72 | 1 | OBSOLETE | ||
| Rochester Electronics | The BSP742RI is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RI is currently in active production through Rochester Electronics's standard distribution channels. | Check | 13.800 In Stock | $1.70 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP742RINT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RINT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP742RIXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RIXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 36.000 In Stock | $0.9360 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP742RNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP742RXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 17.439 In Stock | $1.58 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP742TNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742TNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP752RNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752RNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP752RXUMA2 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752RXUMA2 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 30.893 In Stock | $1.11 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP752TNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752TNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BSP752TXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752TXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 15.943 In Stock | $1.84 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75GQTA is a power distribution IC manufactured by Diodes Incorporated, part of the Automotive, AEC-Q101, INTELLIFET® series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75GQTA is currently in active production through Diodes Incorporated's standard distribution channels. | TO-261-4, TO-261AA | 9.607 In Stock | $0.6506 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75GQTC is a power distribution IC manufactured by Diodes Incorporated, part of the Automotive, AEC-Q101, INTELLIFET® series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in an SOT-223-3 package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75GQTC is currently in active production through Diodes Incorporated's standard distribution channels. | Check | 547 In Stock | $1.86 | 1 | ACTIVE | ||
| Diodes Incorporated | The BSP75GTA is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75GTA is currently in active production through Diodes Incorporated's standard distribution channels. | TO-261-4, TO-261AA | 13.831 In Stock | $1.49 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP75NHUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NHUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | TO-261-4, TO-261AA | 1.540 In Stock | $0.8277 | 1 | ACTIVE | ||
| Infineon Technologies | The BSP75NNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | 1 | OBSOLETE |