Component category
Power Management
FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| ROHM Semiconductor | The BU90002GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90002GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, WLCSP | 11.610 In Stock | $1.03 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90003GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90003GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, WLCSP | 8.601 In Stock | $1.04 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90004GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90004GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, WLCSP | 4.263 In Stock | $1.05 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90005GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90005GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, WLCSP | 9.000 In Stock | $1.04 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90006GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90006GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, WLCSP | 1.723 In Stock | $1.67 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90007GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90007GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, CSPBGA | 1.600 In Stock | $1.05 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90008GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90008GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, CSPBGA | 3.096 In Stock | $0.7020 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90009GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 6-XFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90009GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, CSPBGA | 1.540 In Stock | $1.70 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90023NUX-TR is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90023NUX-TR is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-UFDFN Exposed Pad | 12.000 In Stock | $0.5125 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90028NUX-TR is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-UFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90028NUX-TR is currently in active production through ROHM Semiconductor's standard distribution channels. | 8-UFDFN Exposed Pad | 9.532 In Stock | $0.8640 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90030G-TR is an LED driver IC manufactured by ROHM Semiconductor. Technical highlights include -35°C ~ 85°C (TA) operating temperature; design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits. This Surface Mount component is supplied in an SC-74, SOT-457 package and is rated for operation across -35°C ~ 85°C (TA). Designed for motor control, LED lighting, and display backlight applications, the BU90030G-TR is currently in active production through ROHM Semiconductor's standard distribution channels. | SC-74, SOT-457 | 4.902 In Stock | $1.23 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90054GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90054GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, CSPBGA | 1.550 In Stock | $1.06 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU9006GUZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -30°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 9-XFBGA, WLCSP package and is rated for operation across -30°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU9006GUZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 9-XFBGA, WLCSP | 9.000 In Stock | $0.6336 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU90104GWZ-E2 is a DC-DC converter manufactured by ROHM Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, buck or boost topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-XFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the BU90104GWZ-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-XFBGA, CSPBGA | 9.000 In Stock | $0.7020 | 1 | ACTIVE | ||
| NXP Semiconductors | The BUK100-50GL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK100-50GL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK101-50GL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK101-50GL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK101-50GS,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK101-50GS,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK107-50DL,115 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK107-50DL,115 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK108-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK108-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $4.32 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK109-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK109-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $3.95 | 1 | OBSOLETE |