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Component category

Power Management - Specialized

FPGACenter stocks 7,428 Power Management - Specialized part numbers across Texas Instruments, Rochester, and Maxim. IDEA-1010 inspected, worldwide delivery.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
MicrochipThe MCP16502TAD-E/S8BVAO is a specialized power management IC manufactured by Microchip. Key technical specifications include 2.7V ~ 5.5V input voltage, 120µA quiescent current, and -40°C ~ 125°C (TJ) operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCP16502TAD-E/S8BVAO is currently in active production through Microchip's standard distribution channels.32-VFQFN Exposed Pad1.589 In Stock$12.601ACTIVE
MicrochipThe MCP16502TAE-E/S8BVAO is a specialized power management IC manufactured by Microchip. Key technical specifications include 2.7V ~ 5.5V input voltage, 120µA quiescent current, and -40°C ~ 125°C (TJ) operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCP16502TAE-E/S8BVAO is currently in active production through Microchip's standard distribution channels.32-VFQFN Exposed Pad844 In Stock$7.601ACTIVE
NXP SemiconductorsThe MCZ33099CEG is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 7V ~ 18V input voltage, 6.5mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33099CEG is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.295", 7.50mm Width)RFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MCZ33099CEGR2 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 7V ~ 18V input voltage, 6.5mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33099CEGR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.295", 7.50mm Width)RFQ for sourcing$11.471OBSOLETE
NXP SemiconductorsThe MCZ33099EG is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 7V ~ 18V input voltage, 6.5mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33099EG is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.295", 7.50mm Width)RFQ for sourcing$8.891OBSOLETE
NXP SemiconductorsThe MCZ33099EGR2 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 7V ~ 18V input voltage, 6.5mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33099EGR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.295", 7.50mm Width)RFQ for sourcingRFQ1OBSOLETE
MCZ3334EF
NXP SemiconductorsThe MCZ3334EF is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include 4V ~ 24V input voltage; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ3334EF is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$2.391OBSOLETE
NXP SemiconductorsThe MCZ3334EFR2 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include 4V ~ 24V input voltage; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ3334EFR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$3.651OBSOLETE
NXP SemiconductorsThe MCZ33689DEW is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.5V ~ 18V input voltage, 5mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 32-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33689DEW is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-BSSOP (0.295", 7.50mm Width)RFQ for sourcing$5.851OBSOLETE
NXP SemiconductorsThe MCZ33689DEWR2 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.5V ~ 18V input voltage, 5mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 32-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33689DEWR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-BSSOP (0.295", 7.50mm Width)RFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MCZ33742SEG is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.5V ~ 18V input voltage, 42mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33742SEG is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.28-SOIC (0.295", 7.50mm Width)RFQ for sourcing$6.821OBSOLETE
NXP SemiconductorsThe MCZ33742SEGR2 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.5V ~ 18V input voltage, 42mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33742SEGR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.28-SOIC (0.295", 7.50mm Width)RFQ for sourcing$8.341OBSOLETE
MCZ33789AE
NXP SemiconductorsThe MCZ33789AE is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include 5.2V ~ 20V input voltage and -40°C ~ 125°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 64-LQFP Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33789AE is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.64-LQFP Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MCZ33789AER2 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include 5.2V ~ 20V input voltage and -40°C ~ 125°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 64-LQFP Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33789AER2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.64-LQFP Exposed PadRFQ for sourcingRFQ1OBSOLETE
Rochester ElectronicsThe MCZ33789BAE is a specialized power management IC manufactured by Rochester Electronics. Technical highlights include 5.2V ~ 20V input voltage and -40°C ~ 125°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 64-LQFP Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33789BAE is currently in active production through Rochester Electronics's standard distribution channels.64-LQFP Exposed Pad4.026 In Stock$7.591ACTIVE
Rochester ElectronicsThe MCZ33789BAE,557 is a specialized power management IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33789BAE,557 is currently in active production through Rochester Electronics's standard distribution channels.Check1.004 In StockRFQ1ACTIVE
NXP SemiconductorsThe MCZ33789BAER2 is a specialized power management IC manufactured by NXP Semiconductors. Technical highlights include 5.2V ~ 20V input voltage and -40°C ~ 125°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 64-LQFP Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33789BAER2 is currently in active production through NXP Semiconductors's standard distribution channels.64-LQFP Exposed Pad13.500 In Stock$8.011ACTIVE
NXP SemiconductorsThe MCZ33800EK is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5V ~ 36V input voltage, 10mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33800EK is currently in active production through NXP Semiconductors's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad9.000 In Stock$9.681ACTIVE
NXP SemiconductorsThe MCZ33800EKR2 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5V ~ 36V input voltage, 10mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33800EKR2 is currently in active production through NXP Semiconductors's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad1.236 In Stock$15.781ACTIVE
NXP SemiconductorsThe MCZ33810EK is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 4.5V ~ 36V input voltage, 10mA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33810EK is currently in active production through NXP Semiconductors's standard distribution channels.32-SSOP (0.295", 7.50mm Width) Exposed Pad1.764 In Stock$3.071ACTIVE
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