Component category
Power Management - Specialized
FPGACenter stocks 7,428 Power Management - Specialized part numbers across Texas Instruments, Rochester, and Maxim. IDEA-1010 inspected, worldwide delivery.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The TDA3608TH/N3C,518 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 9.5V ~ 18V input voltage, 500µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 20-SOIC (0.433", 11.00mm Width) Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3608TH/N3C,518 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | RFQ for sourcing | $9.09 | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3616SF/N1,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.6V ~ 25V input voltage, 95µA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 9-SIP Exposed Tab package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3616SF/N1,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 9-SIP Exposed Tab | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3616T/N1,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.6V ~ 25V input voltage, 95µA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3616T/N1,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3616T/N1,118 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 5.6V ~ 25V input voltage, 95µA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3616T/N1,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $4.14 | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3617J/N1C,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 9.5V ~ 17.5V input voltage, 5µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 9-SIP Formed Leads package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3617J/N1C,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 9-SIP Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3618AJR/N3C,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 11V ~ 18V input voltage, 400µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 17-SIP Formed Leads package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3618AJR/N3C,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 17-SIP Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3618JR/N1C,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 11V ~ 18V input voltage, 310µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 17-SIP Formed Leads package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3618JR/N1C,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 17-SIP Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629/N2,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629/N2,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629/Y,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629/Y,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629/YWU is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629/YWU is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629T/N2,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629T/N2,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629T/N2,118 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629T/N2,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $2.44 | 1 | OBSOLETE | ||
| Rochester Electronics | The TDA3629T/YM,112 is a specialized power management IC manufactured by Rochester Electronics. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629T/YM,112 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629T/YM,118 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629T/YM,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $2.49 | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3629T/YM/WJ is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 8V ~ 18V input voltage, 6mA quiescent current, and -40°C ~ 105°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 105°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3629T/YM/WJ is currently in active production through NXP Semiconductors's standard distribution channels. | 16-SOIC (0.154", 3.90mm Width) | 1.608 In Stock | RFQ | 1 | ACTIVE | ||
| NXP Semiconductors | The TDA3681ATH/N1C,512 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 9.5V ~ 18V input voltage, 110µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 20-SOIC (0.433", 11.00mm Width) Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3681ATH/N1C,512 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3681ATH/N1C,518 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 9.5V ~ 18V input voltage, 110µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 20-SOIC (0.433", 11.00mm Width) Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3681ATH/N1C,518 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | RFQ for sourcing | $10.80 | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3681J/N2C,112 is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 9.5V ~ 18V input voltage, 110µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 17-SIP Formed Leads package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3681J/N2C,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 17-SIP Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The TDA3681JR/N2C is a specialized power management IC manufactured by NXP Semiconductors. Key technical specifications include 9.5V ~ 18V input voltage, 110µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 17-SIP Formed Leads package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3681JR/N2C is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 17-SIP Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The TDA3681JR/N2S is a specialized power management IC manufactured by Rochester Electronics. Key technical specifications include 9.5V ~ 18V input voltage, 110µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Through Hole component is supplied in a 17-SIP Formed Leads package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDA3681JR/N2S is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 17-SIP Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE |