Hard-to-find, EOL, and shortage parts24h target RFQ responseInspection, traceability, and alternate sourcing
Component category

Special Purpose ICs

Find Special Purpose ICs from Intersil, Maxim, and additional brands. 4,707 part numbers available at FPGACenter. Volume pricing, no minimum order.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
MicrochipThe LX1660CD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1660CD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1660CN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 16-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1660CN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1661CD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1661CD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1661CN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 16-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1661CN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1662ACD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1662ACD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.14-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1662ACN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 14-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1662ACN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.14-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1662CD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1662CD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.14-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1662CN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 14-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1662CN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.14-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1663ACD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1663ACD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1663ACN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 16-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1663ACN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1663CD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1663CD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1663CN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 16-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1663CN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1664ACD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1664ACD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1664ACN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 16-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1664ACN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1664CD is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1664CD is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1664CN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 16-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1664CN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1665ACDW is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1665ACDW is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.18-SOIC (0.295", 7.50mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1665ACN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 18-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1665ACN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.18-DIPRFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1665CDW is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1665CDW is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.18-SOIC (0.295", 7.50mm Width)RFQ for sourcingRFQ1OBSOLETE
MicrochipThe LX1665CN is a specialized telecom IC manufactured by Microchip. Technical highlights include 10.8V ~ 13.2V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 18-DIP package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LX1665CN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.18-DIPRFQ for sourcingRFQ1OBSOLETE
Get Quote