Component category
Specialized ICs
Find Specialized ICs from Rochester, Renesas, and additional brands. 12,415 part numbers available at FPGACenter. No MOQ, fast global shipping.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Renesas | The TSI568A-10GILY is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BBGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI568A-10GILY is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BBGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI572-10GCL is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI572-10GCL is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI572-10GCLV is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI572-10GCLV is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI572-10GIL is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI572-10GIL is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI572-10GILV is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI572-10GILV is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI574-10GCL is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI574-10GCL is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI574-10GCLV is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI574-10GCLV is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | $1.90 | 1 | OBSOLETE | ||
| Renesas | The TSI574-10GIL is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI574-10GIL is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Flip Electronics | The TSI574-10GILV is a specialized telecom IC manufactured by Flip Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI574-10GILV is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI576-10GCLY is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BBGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI576-10GCLY is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BBGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI576-10GILY is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BBGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI576-10GILY is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BBGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Waldom Electronics | The TSI577-10GCLV is a specialized telecom IC manufactured by Waldom Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI577-10GCLV is no longer produced by Waldom Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Flip Electronics | The TSI577-10GILV is a specialized telecom IC manufactured by Flip Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI577-10GILV is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI578-10GCL is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GCL is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI578-10GCLH is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GCLH is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI578-10GCLV is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GCLV is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI578-10GCLY is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GCLY is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BGA, FCBGA | RFQ for sourcing | $4.50 | 1 | OBSOLETE | ||
| Flip Electronics | The TSI578-10GIL is a specialized telecom IC manufactured by Flip Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BBGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GIL is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BBGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI578-10GILH is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GILH is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Renesas | The TSI578-10GILV is a specialized telecom IC manufactured by Renesas. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GILV is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BGA, FCBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE |