The ZL88702LDF1 is a specialized telecom IC manufactured by Microchip. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and PCM interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ZL88702LDF1 is currently in active production through Microchip's standard distribution channels.
The ZL88702LDG1 is a specialized telecom IC manufactured by Microchip. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and PCM interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ZL88702LDG1 is currently in active production through Microchip's standard distribution channels.
The ZL88801LDF1 is a specialized telecom IC manufactured by Microchip. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and PCM interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ZL88801LDF1 is currently in active production through Microchip's standard distribution channels.
The ZL88801LDG1 is a specialized telecom IC manufactured by Microchip. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and PCM interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ZL88801LDG1 is currently in active production through Microchip's standard distribution channels.