Component category
Telecom & Specialized
Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Texas Instruments | The DS250DF400ABMT is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS250DF400ABMT is currently in active production through Texas Instruments's standard distribution channels. | Check | 10 In Stock | RFQ | 1 | ACTIVE | ||
| Texas Instruments | The DS250DF410ABMR is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 101-TFBGA, FCCSP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS250DF410ABMR is currently in active production through Texas Instruments's standard distribution channels. | 101-TFBGA, FCCSP | 2.791 In Stock | $75.61 | 1 | ACTIVE | ||
| Texas Instruments | The DS250DF410ABMT is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 101-TFBGA, FCCSP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS250DF410ABMT is currently in active production through Texas Instruments's standard distribution channels. | 101-TFBGA, FCCSP | 1.779 In Stock | $37.26 | 1 | ACTIVE | ||
| Texas Instruments | The DS250DF810ABVR is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 135-BGA Module package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS250DF810ABVR is currently in active production through Texas Instruments's standard distribution channels. | 135-BGA Module | 1.502 In Stock | $119.36 | 1 | ACTIVE | ||
| Texas Instruments | The DS250DF810ABVT is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 135-BGA Module package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS250DF810ABVT is currently in active production through Texas Instruments's standard distribution channels. | 135-BGA Module | 5.130 In Stock | $51.87 | 1 | ACTIVE | ||
| Rochester Electronics | The DS26102 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26102 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 1.730 In Stock | $74.49 | 1 | ACTIVE | ||
| Rochester Electronics | The DS26303L-120 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303L-120 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 1.503 In Stock | $41.86 | 1 | ACTIVE | ||
| Rochester Electronics | The DS26303L-120+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303L-120+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | $21.14 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26303L-120+A3 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303L-120+A3 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | $21.14 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS26303L-75+ is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303L-75+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $24.11 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26303L-75+A3 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303L-75+A3 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | $89.99 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26303LN-120+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303LN-120+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | $10.86 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26303LN-120+A3 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303LN-120+A3 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The DS26303LN-75+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303LN-75+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | $1.17 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26303LN-75+A3 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-LQFP Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26303LN-75+A3 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26324G is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26324G is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | $7.81 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26324G+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26324G+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | $0.9000 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26324GN is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26324GN is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | $0.9000 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26324GN+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26324GN+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | $7.30 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26324GN+T&R is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26324GN+T&R is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | $13.50 | 1 | OBSOLETE |