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Component category

Telecom & Specialized

Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Texas InstrumentsThe EMB1499QMHX/NOPB is a specialized telecom IC manufactured by Texas Instruments. Technical highlights include 10V ~ 14V supply voltage and -40°C ~ 125°C (TJ) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-TSSOP (0.173", 4.40mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TJ). Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EMB1499QMHX/NOPB is currently in active production through Texas Instruments's standard distribution channels.28-TSSOP (0.173", 4.40mm Width) Exposed Pad27.039 In Stock$6.251ACTIVE
Rochester ElectronicsThe EMC6D100-DK is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EMC6D100-DK is currently in active production through Rochester Electronics's standard distribution channels.Check1.518 In Stock$4.821ACTIVE
ams OSRAMThe ENDAT_BASIC_UC_COMPLETE is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ENDAT_BASIC_UC_COMPLETE is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcingRFQ1OBSOLETE
ams OSRAMThe ENDAT_MASTER_REDUCED is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ENDAT_MASTER_REDUCED is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcingRFQ1OBSOLETE
Analog DevicesThe ENG24033EMY+ is a specialized telecom IC manufactured by Analog Devices. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ENG24033EMY+ is no longer produced by Analog Devices; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcingRFQ1OBSOLETE
Rochester ElectronicsThe ENGRSAMPPF is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the ENGRSAMPPF is currently in active production through Rochester Electronics's standard distribution channels.Check1.245 In StockRFQ1ACTIVE
Rochester ElectronicsThe EP610LC-15-G is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EP610LC-15-G is currently in active production through Rochester Electronics's standard distribution channels.Check1.684 In Stock$59.951ACTIVE
Rochester ElectronicsThe EPC50C605 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EPC50C605 is currently in active production through Rochester Electronics's standard distribution channels.Check1.775 In StockRFQ1ACTIVE
Rochester ElectronicsThe EQ50F100LR/NOPB is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 1.71V ~ 1.89V supply voltage and Serial interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-WDFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQ50F100LR/NOPB is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.6-WDFN Exposed PadRFQ for sourcing$8.221OBSOLETE
Texas InstrumentsThe EQ50F100LRE/NOPB is a specialized telecom IC manufactured by Texas Instruments. Technical highlights include 1.71V ~ 1.89V supply voltage and Serial interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-WDFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQ50F100LRE/NOPB is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners.6-WDFN Exposed PadRFQ for sourcing$8.361OBSOLETE
MicrochipThe EQCO400T8 is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.135V ~ 3.465V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO400T8 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
MicrochipThe EQCO850SC.1 is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO850SC.1 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcing$12.601OBSOLETE
MicrochipThe EQCO850SC.2 is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.135V ~ 3.465V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO850SC.2 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcing$12.601OBSOLETE
MicrochipThe EQCO850SC.3 is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO850SC.3 is currently in active production through Microchip's standard distribution channels.16-VQFN Exposed Pad1.994 In Stock$25.701ACTIVE
MicrochipThe EQCO850SC.3-HS is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO850SC.3-HS is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcing$12.601OBSOLETE
MicrochipThe EQCO850SC.3-HS-TRAY is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.2V ~ 3.4V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO850SC.3-HS-TRAY is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
MicrochipThe EQCO850SC.3-TRAY is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO850SC.3-TRAY is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
MicrochipThe EQCO875SC.2 is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO875SC.2 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcing$12.601OBSOLETE
MicrochipThe EQCO875SC.3 is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO875SC.3 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcing$17.961OBSOLETE
MicrochipThe EQCO875SC.3-HS is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-VQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the EQCO875SC.3-HS is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.16-VQFN Exposed PadRFQ for sourcing$12.601OBSOLETE
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