Component category
Telecom & Specialized
Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Rochester Electronics | The MCZ33884EGR2 is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 7V ~ 26V supply voltage and SPI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33884EGR2 is currently in active production through Rochester Electronics's standard distribution channels. | 24-SOIC (0.295", 7.50mm Width) | 11.599 In Stock | $2.55 | 1 | ACTIVE | ||
| NXP Semiconductors | The MCZ33889BEG is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 18V supply voltage and CAN, SPI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33889BEG is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $8.93 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33889BEGR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 18V supply voltage and CAN, SPI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33889BEGR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33889DEG is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 18V supply voltage and CAN, SPI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33889DEG is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $8.93 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33889DEGR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 18V supply voltage and CAN, SPI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33889DEGR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $11.02 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33902EF is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33902EF is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $0.6231 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33902EFR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33902EFR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $89.99 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903B3EKR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903B3EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903B5EK is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903B5EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903B5EKR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903B5EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903BD3EK is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BD3EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $2.54 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903BD3EKR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BD3EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The MCZ33903BD5EK is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BD5EK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $2.26 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903BD5EKR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BD5EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The MCZ33903BS3EK is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BS3EK is currently in active production through Rochester Electronics's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 1.584 In Stock | $2.24 | 1 | ACTIVE | ||
| NXP Semiconductors | The MCZ33903BS3EKR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BS3EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $1.98 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903BS5EK is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BS5EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $1.92 | 1 | OBSOLETE | ||
| Rochester Electronics | The MCZ33903BS5EKR2 is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 5.5V ~ 28V supply voltage and CAN, LIN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903BS5EKR2 is currently in active production through Rochester Electronics's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 984 In Stock | RFQ | 1 | ACTIVE | ||
| NXP Semiconductors | The MCZ33903C3EK is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903C3EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $3.30 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MCZ33903C3EKR2 is a specialized telecom IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 28V supply voltage and CAN interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MCZ33903C3EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $3.85 | 1 | OBSOLETE |