| TL431CLPREG | Voltage References | The TL431CLPREG is a voltage reference manufactured by Flip Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm input voltage, output voltage, voltage threshold, LDO or supervisor behavior when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-226-3, TO-92-3 Long Body (Formed Leads) package and is rated for operation across 0°C ~ 70°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the TL431CLPREG is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-226-3, TO-92-3 Long Body (Formed Leads) | RFQ for sourcing | $0.1144 | OBSOLETE | RFQ |
| TMA545-48LQI36ZZA | Microcontrollers (MCU) | The TMA545-48LQI36ZZA is a microcontroller manufactured by Flip Electronics. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the TMA545-48LQI36ZZA is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | $4.95 | OBSOLETE | RFQ |
| TSI107D-100JEY | Specialized ICs | The TSI107D-100JEY is a specialized telecom IC manufactured by Flip Electronics. Technical highlights include 2.5V, 3.3V supply voltage and PCI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 503-BBGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI107D-100JEY is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 503-BBGA, FCBGA | RFQ for sourcing | $10.38 | OBSOLETE | RFQ |
| TSI148-133CLY | Specialized ICs | The TSI148-133CLY is a specialized telecom IC manufactured by Flip Electronics. Technical highlights include 3.3V supply voltage and PCI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 456-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI148-133CLY is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | $1426.68 | OBSOLETE | RFQ |
| TSI148-133ILY | Specialized ICs | The TSI148-133ILY is a specialized telecom IC manufactured by Flip Electronics. Technical highlights include 1.8V supply voltage and PCI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 456-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI148-133ILY is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | $2533.34 | OBSOLETE | RFQ |
| TSI574-10GILV | Specialized ICs | The TSI574-10GILV is a specialized telecom IC manufactured by Flip Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI574-10GILV is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| TSI577-10GILV | Specialized ICs | The TSI577-10GILV is a specialized telecom IC manufactured by Flip Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 399-BGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI577-10GILV is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 399-BGA Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| TSI578-10GIL | Specialized ICs | The TSI578-10GIL is a specialized telecom IC manufactured by Flip Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 675-BBGA, FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TSI578-10GIL is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 675-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| TW8806EP-PB2-GRS | Video Processing ICs | The TW8806EP-PB2-GRS is a video/display IC manufactured by Flip Electronics. Technical highlights include 1.8V, 3.3V supply voltage; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 128-QFP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the TW8806EP-PB2-GRS is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 128-QFP | RFQ for sourcing | $53.68 | OBSOLETE | RFQ |
| USB2SERA11CFK | Interface Controllers | The USB2SERA11CFK is an interface IC manufactured by Flip Electronics. Key technical specifications include 2.7V ~ 5.5V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 24-VQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the USB2SERA11CFK is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-VQFN Exposed Pad | RFQ for sourcing | $60.00 | OBSOLETE | RFQ |
| X28HC256PZ-90 | EEPROM | The X28HC256PZ-90 is an EEPROM memory IC manufactured by Flip Electronics. Key technical specifications include 256Kb (32K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the X28HC256PZ-90 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP (0.600", 15.24mm) | RFQ for sourcing | $86.42 | OBSOLETE | RFQ |
| X5045PIZ-4.5A | Supervisors & Reset ICs | The X5045PIZ-4.5A is a voltage supervisor manufactured by Flip Electronics. Key technical specifications include Open Drain or Open Collector output type, 4.62V voltage threshold, 1 monitored voltage, 100ms Minimum reset timeout, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm input voltage, output voltage, and voltage threshold. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the X5045PIZ-4.5A is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-DIP (0.300", 7.62mm) | 7,620 In Stock | $2.31 | LTB | RFQ |
| X9313WPIZ | Digital Potentiometers | The X9313WPIZ is a digital potentiometer manufactured by Flip Electronics. Technical highlights include 5V supply voltage and ±20% accuracy; design review should confirm ADC or DAC signal-chain requirements, channel count, resolution, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for instrumentation, medical devices, and audio systems applications, the X9313WPIZ is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| X93256WV14IZ-2.7 | Digital Potentiometers | The X93256WV14IZ-2.7 is a digital potentiometer manufactured by Flip Electronics. Technical highlights include 2.7V ~ 5.5V supply voltage and ±25% accuracy; design review should confirm ADC or DAC signal-chain requirements, channel count, resolution, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for instrumentation, medical devices, and audio systems applications, the X93256WV14IZ-2.7 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $4.94 | OBSOLETE | RFQ |
| X9511WPIZ | Digital Potentiometers | The X9511WPIZ is a digital potentiometer manufactured by Flip Electronics. Technical highlights include 5V supply voltage and ±20% accuracy; design review should confirm ADC or DAC signal-chain requirements, channel count, resolution, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for instrumentation, medical devices, and audio systems applications, the X9511WPIZ is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $21.50 | OBSOLETE | RFQ |
| X9C303S8IZ | Digital Potentiometers | The X9C303S8IZ is a digital potentiometer manufactured by Flip Electronics. Technical highlights include 4.5V ~ 5.5V supply voltage; design review should confirm ADC or DAC signal-chain requirements, channel count, resolution, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for instrumentation, medical devices, and audio systems applications, the X9C303S8IZ is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XPC823ECVR66B2 | Microprocessors (MPU) | The XPC823ECVR66B2 is a microprocessor manufactured by Flip Electronics. Technical highlights include 66MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 256-BBGA package and is rated for operation across -40°C ~ 95°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XPC823ECVR66B2 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BBGA | RFQ for sourcing | $0.0090 | OBSOLETE | RFQ |
| XPC823ECZT66BA | Microprocessors (MPU) | The XPC823ECZT66BA is a microprocessor manufactured by Flip Electronics. Technical highlights include 66MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 256-BBGA package and is rated for operation across -40°C ~ 95°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XPC823ECZT66BA is currently in active production through Flip Electronics's standard distribution channels. | 256-BBGA | 708 In Stock | $37.90 | ACTIVE | RFQ |
| XPC823EZT66BA | Microprocessors (MPU) | The XPC823EZT66BA is a microprocessor manufactured by Flip Electronics. Technical highlights include 66MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 256-BBGA package and is rated for operation across 0°C ~ 95°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XPC823EZT66BA is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BBGA | RFQ for sourcing | $83.22 | OBSOLETE | RFQ |
| XPC823EZT75BA | Microprocessors (MPU) | The XPC823EZT75BA is a microprocessor manufactured by Flip Electronics. Technical highlights include 75MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 256-BBGA package and is rated for operation across 0°C ~ 95°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XPC823EZT75BA is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BBGA | RFQ for sourcing | $5.48 | OBSOLETE | RFQ |